Cooling device provided with multi-angle adjusting function and used for wafer baking

Abstract

The invention discloses a cooling device provided with a multi-angle adjusting function and used for wafer baking. The cooling device comprises a base, a water cooling bin is welded and mounted at the top of the base, a water injection pipe is welded and mounted on one side wall of the water cooling bin and located at the top of the water cooling bin, a water drainage pipe is welded and mounted on the other side wall of the water cooling bin and located at the bottom of the water cooling bin, a placing frame is arranged in the water cooling bin, and a sliding groove is formed in the inner side wall of the placing frame. According to the cooling device provided with the multi-angle adjusting function and used for wafer baking, the water cooling bin is arranged and matched with cooling liquid in the water cooling bin, so that a wafer can be effectively and rapidly cooled, the time needed for cooling is shortened to a certain degree, and meanwhile, the cooling efficiency is greatly improved; the device is provided with the drying bin at the top of the water cooling bin, so that the device can directly and effectively treat residual moisture on the surface of the wafer after the wafer is subjected to water cooling, the situation that the subsequent process cannot be carried out due to the residual moisture of the wafer is avoided, and the practicability of the device is greatly improved.

Description

technical field [0001] The invention relates to the technical field of wafers, in particular to a cooling device for wafer baking with multi-angle adjustment functions. Background technique [0002] Photolithography is one of the most important steps in the manufacturing process of semiconductor devices. Generally speaking, the process of photolithography usually includes the following steps: first, the wafer should be cleaned and dried, and the temperature of the wafer baking usually reaches 100 degrees Celsius to remove the moisture on the surface of the wafer to improve the subsequent process. The adhesion of the formed photoresist (PR) to the surface of the wafer; after that, the surface of the wafer is treated with uniform glue (also called glue coating), and the liquid photoresist is dropped on the center of the wafer. Then the chuck is rotated at a high speed, and the photoresist spreads under the action of centrifugal force, thereby evenly covering the surface of th...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a cooling device for wafer baking with a multi-angle adjustment function, which solves the problem that the entire wafer may be damaged due to the high initial temperature of the wafer when the wafer is naturally cooled in the air. The cooling speed is relatively slow, it takes a long time, and the cooling efficiency is low, which causes the cooling process to become the bottleneck of the lithography productivity. When it is naturally cooled in the air, the surface of the wafer is prone to residual moisture, which affects the subsequent process.

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