Heat-shock-resistant heat-conducting adhesive film for aluminum substrate

Abstract

The invention discloses a heat-shock-resistant heat-conducting adhesive film for an aluminum substrate, which is prepared by the following steps of: 1, stirring and mixing a polyurethane material through a mixing device to prepare a polyurethane jelly; 2, putting high-thermal-conductivity filler into the mixing device and mixing the high-thermal-conductivity filler with the polyurethane jelly, and preparing a glue film mixture; 3, putting the adhesive film mixture into a coating device to be coated into a film shape, and preparing an adhesive film layer; 4, flattening the adhesive film semi-finished product through a flattening mechanism, rapidly drying the flattened adhesive film through a drying device, and preparing the adhesive film; and 5, pasting the glue film on the glue film pasting bottom plate. Compared with a traditional adhesive film, polyurethane is adopted as the adhesive body, so that the adhesive film is firmer, and the situation that after boron nitride works for a long time, when an aluminum substrate works in a high-heat-conduction environment, friction or impact of the aluminum substrate in the working period is avoided or reduced, and operation and use of the adhesive film are not excessively affected is avoided.

Description

technical field [0001] The invention relates to the technical field of heat-conducting adhesive film preparation, in particular to a thermal-shock-resistant aluminum substrate heat-conducting adhesive film. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Very few applications are multi-layer boards, which can be made by laminating ordinary multi-layer boards with insulating layers and aluminum bases; [0003] With the rapid development of microelectronics integration technology, the power requirements of electronic products for components are getting higher and higher. ...

AI Technical Summary

Problems solved by technology

[0005] However, the thermal conductivity of traditional aluminum substrates is relatively low, which cannot meet the needs of high thermal conductivity

At present, there are some high thermal conductivity adhesive film aluminum-clad substrates that still have certain deficiencies during operation. The overall thermal conductivity of the adhesive film on the traditional metal substrate is still relatively lacking, resulting in metal substrates appearing after long-term operation. Aging and other phenomena reduce the overall service life, and the overall thermal conductivity still needs to be improved.

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