Phase change energy storage type radiator

Abstract

The invention relates to and discloses a phase change energy storage type radiator which comprises a top cover, a packaging base body, a cold plate and a phase change module. The phase change module comprises a metal foam unit and a phase change material; the top cover, the packaging substrate and the cold plate are assembled to form an internal space for filling the phase change module; and the cold plate is in contact with the radiating surface of the electronic equipment. Blending of cold fluid and hot fluid is promoted through strong disturbance caused by falling of the metal foam unit embedded in the organic phase change material, so that the convection effect in the heat exchange process is enhanced, meanwhile, due to the high heat conductivity of the metal foam unit, the heat conduction effect in the heat exchange process can be remarkably improved when the metal foam unit is added into a radiator, and finally, the purpose of synergistically increasing the heat conduction effect and the convection effect is achieved, so that the heat exchange performance of the phase change energy storage type radiator is comprehensively improved, and the effective protection time of an electronic device is prolonged. The weight and the size of the radiator are optimized, and meanwhile the operation reliability of an electronic device can be improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a phase-change energy storage radiator. Background technique [0002] With the advancement of science and technology, electronic components are developing toward integration, light weight, and miniaturization, which makes the heat flux density of electronic equipment increase sharply, and the problem of heat dissipation becomes increasingly prominent. If a large amount of heat cannot be dissipated in a timely manner in a reasonable manner, the temperature of the electronic device will rise rapidly, which will affect the normal use of the electronic device, and even lead to the complete failure of the electronic device. For special application fields such as missile loading, this will not only cause major economic losses, but also have a major impact on combat missions and even national defense security. [0003] At present, the thermal design for missile-borne electroni...

AI Technical Summary

Problems solved by technology

Among them, inorganic phase change materials include molten salt, metal, alloy and other phase change materials. Among them, the phase change temperature of molten salt is relatively high, and the mass per unit volume of metal and alloy is relatively large, so they are not suitable for application in the field of heat dissipation of missile-borne electronic equipment.

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