Substrate glass positioning and grinding device and processing process thereof

Abstract

The invention discloses a substrate glass positioning and grinding device and a processing process thereof. The device comprises a base, wherein the top of the base is rotationally connected with a transmission roller, the end of the transmission roller is fixedly connected with a gear, the gear is sleeved with a chain, the rear side of the top of the base is fixedly connected with a conveying motor, the middle of the base is fixedly connected with an electric push rod, a baffle is disposed on the upper portion of the electric push rod, limiting plates are symmetrically and fixedly connected to the middle of the bottom end of the base, a first screw is rotationally connected between the limiting plates, and a transverse motor is fixedly connected to one side of each limiting plate. According to the device, mounting rods and clamping blocks on the two sides are extruded inwards through the limitation of the baffle and the transmission of the sleeve and the second screw under the driving of a double-output-shaft motor, so that the substrate glass is located at the center point, the structure is simple, positioning is convenient, operation is rapid, the positioning efficiency is effectively improved, and the situation that dust splashes in the polishing process to pollute the working environment or block a transmission structure to affect use of the device is prevented.

Description

technical field [0001] The invention relates to the technical field of substrate glass processing, in particular to a substrate glass positioning grinding device and a processing technology thereof. Background technique [0002] Substrate glass is one of the key basic materials for the flat panel display industry. A layer of In2O3 or SnO2 transparent conductive layer, namely ITO film layer, is deposited on the surface. Transparent conductive patterns are made by photolithography. These graphics consist of pixel graphics and external lead graphics. Therefore, the outer leads cannot be traditionally soldered, and can only be connected through conductive rubber strips or conductive tapes. If scratched, cut or corroded, the device will be scrapped. [0003] Substrate glass needs to be cut and polished as needed during the production process, but it is usually manually operated after cutting, and some grinding machines need to be cumbersomely positioned and fastened before gr...

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