Ceramic carrier plate for polishing semiconductor wafers

Abstract

The invention discloses an integral polishing ceramic carrier plate for wax-free polishing of semiconductor wafers. The ceramic carrier plate comprises a plate body and a groove located on the plate body, the groove and the plate body are integrated, the top of the groove is flush with the plate body, the groove is distributed on the periphery of the upper end of the plate body and is in a rotational symmetry shape, and the groove is used for bearing the semiconductor wafers. The problems that the temperature is low in the polishing process of the semiconductor wafers and the removal rate cannot be increased are solved, meanwhile, it is guaranteed that the wafers cannot slide and shake in the machining process, and the machining quality of the wafers is guaranteed.

Description

technical field [0001] The invention relates to the technical field of crystal growth processing, in particular to a ceramic carrier used for semiconductor wafer polishing. Background technique [0002] In order to ensure that the TTV (Total Thickness Variation, substrate thickness difference) and surface roughness after semiconductor wafer processing are in compliance, the wafer needs to be fixed with wax before polishing. Since the softening temperature of the wax is about 40°C, the temperature of the semiconductor wafer cannot exceed 40°C when it is polished or polished, otherwise it will cause slippery wax during the polishing process, and the wafer will fall off and cause fragments. However, the higher the temperature, the chemical in the polishing process. The faster the reaction speed, the higher the temperature in the polishing process of the semiconductor wafer due to the presence of the wax, and the insufficient chemical action in the polishing process, the removal...

AI Technical Summary

Problems solved by technology

[0003] In view of the problems occurring in the above-mentioned semiconductor wafer processing process, the present invention provides a semiconductor wafer polishing method, which uses the ceramic carrier disc provided by the present invention for semiconductor wafer polishing in the polishing process to solve the problem of semiconductor wafer polishing. During the polishing process, the removal rate cannot be accelerated due to low temperature, and at the same time, it ensures that the wafer will not slip and shake during processing, and the processing quality of the wafer is guaranteed.

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