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Resin composition and product thereof

A technology of resin composition and resin, which is applied in the field of resin composition of products, can solve problems such as unsatisfactory dielectric loss

Active Publication Date: 2021-08-13
ELITE ELECTRONICS MATERIAL KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]In view of the problems encountered in the prior art, especially the existing materials cannot meet the dielectric loss, the tensile force on the copper foil (3 micron copper foil), the ten-layer The heat resistance of T300 board, the glass transition temperature of the ten-layer board, the explosion temperature of the ten-layer board, the amount of glue flowing in the board, the glue filling in the open area, etc., are one or more technical problems. The present invention discloses a resin composition. The content of maleimide resin is 100 parts by weight, and the resin composition comprises:

Method used

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  • Resin composition and product thereof
  • Resin composition and product thereof
  • Resin composition and product thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0142] Preparation example 1 synthetic core-shell rubber A1

[0143] Add styrene-butadiene rubber latex (SBR, purchased from Qilong Chemical Co., Ltd., Zibo City, Shandong Province) in the four-necked flask, keep stirring and add K 2 S 2 o 8 and rosin acid soap emulsifier, the water bath is heated to 75 ℃, the methyl methacrylate monomer (MMA, purchased from Tianjin Institute of Chemical Reagents) in the dropping funnel is slowly added in the four-necked flask, and the addition of SBR and MMA is controlled. The mass ratio is 9.5:0.5, and after continuous reaction at this temperature for 4 hours, the obtained copolymer emulsion undergoes coagulation, washing, filtration and spray drying processes to obtain a core component of styrene-butadiene rubber and a shell component of polymethyl methacrylate. ester, and the core-shell ratio of 9.5:0.5 nano-core-shell rubber particles.

preparation example 2

[0144] Preparation example 2 synthetic core-shell rubber A2

[0145] Except for controlling the addition mass ratio of SBR and MMA to be 8.0:2.0, the other steps are the same as in Preparation Example 1 to obtain a nano-core whose core component is styrene-butadiene rubber, shell component is polymethyl methacrylate, and the core-shell ratio is 8.0:2.0 Shell rubber particles.

preparation example 3

[0146] Preparation example 3 synthetic core-shell rubber A3

[0147] Except for controlling the addition mass ratio of SBR and MMA to be 6.0:4.0, the remaining steps are the same as in Preparation Example 1 to obtain a nano-core whose core component is styrene-butadiene rubber, shell component is polymethyl methacrylate, and the core-shell ratio is 6.0:4.0 Shell rubber particles.

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Abstract

The invention discloses a resin composition which comprises core-shell rubber, vinyl-containing benzoxazine resin and maleimide resin, and the core-shell ratio of the core-shell rubber is 6.0:4.0 to 9.5:0.5. The resin composition can be made into various products, such as prepregs, resin films, laminated boards or printed circuit boards, and at least one of the characteristics of dielectric loss, tensile force to copper foil (3-micron copper foil), T300 heat resistance of ten-layer boards, glass transition temperature of the ten-layer boards, explosion temperature of the ten-layer boards, glue flowing amount in the boards, glue filling in open areas and the like is improved.

Description

technical field [0001] The invention relates to a resin composition and its products, in particular to a resin composition which can be used to prepare products such as prepregs, resin films, laminates and printed circuit boards. Background technique [0002] With the advent of the 5G era, a new round of technical upgrading of printed circuit boards for mobile communications and automotive electronics is being promoted, which requires that the basic insulating materials in printed circuit boards not only have low dielectric properties, high reliability, but also high resistance Thermal and excellent fluidity, etc., to adapt to the processability of multiple pressing and multiple assembly during the production of printed circuit boards. In the prior art, in order to meet high reliability, maleimide (maleimide) resin is usually selected together with benzoxazine resin to make laminates and printed circuit boards. However, traditional benzoxazine resin is combined with maleimid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L61/34C08L9/06C08L33/12C08L83/04C08L71/12C08L79/04C08K7/18H05K1/03
CPCC08L79/085H05K1/0373C08L2207/53C08L2203/20C08L2205/025C08L2205/035C08L2201/08C08L61/34C08L9/06C08L33/12C08K7/18C08L83/04C08L71/123C08L79/04C08L79/02C08F279/02C08J5/244C08J2379/08H05K1/0346C08G77/445C08G77/38B32B2260/048B32B2255/10B32B5/024B32B2457/08B32B2307/54B32B2255/26B32B2307/732B32B15/14B32B5/022B32B2260/046B32B2250/03B32B2250/40B32B2264/104B32B5/26B32B2307/558B32B2260/021B32B2307/30B32B2262/0292B32B2262/0276B32B15/20B32B2264/107B32B2250/05B32B2307/538B32B2264/102B32B2262/101B32B2307/306C08F220/14C08L33/10C08L83/10C08L79/08C08J2337/00C08J5/18H05K1/095C08K5/0066C08K5/0025C08K3/013H05K1/188C08J2363/00C08J2383/04C08J2333/10C08L37/00C08J5/246
Inventor 姚兴星王荣涛贾宁宁
Owner ELITE ELECTRONICS MATERIAL KUNSHAN