Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Vertically-assembled PCBA board based on wave soldering and electronic component

A vertical assembly, wave soldering technology, applied in the field of identification, can solve the problem that PCBA does not support wave soldering, etc., to achieve good soldering quality, ensure soldering quality, and improve soldering efficiency.

Pending Publication Date: 2021-08-13
GUANGZHOU ZHIYUAN ELECTRONICS CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a vertically assembled PCBA board and electronic components based on wave soldering, which can solve the technical problem that the traditional vertical soldering assembly method PCBA does not support wave soldering, so as to improve soldering efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vertically-assembled PCBA board based on wave soldering and electronic component
  • Vertically-assembled PCBA board based on wave soldering and electronic component
  • Vertically-assembled PCBA board based on wave soldering and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] figure 1 It is a structural schematic diagram of a vertically assembled PCBA board based on wave soldering under the first perspective provided by Embodiment 1 of the present application. refer to figure 1 , vertically assembling the PCBA board includes: a PCBA sub-board 10 and a PCBA bottom board 20 , and the PCBA sub-board 10 is vertically installed on the PCBA bottom board 20 .

[0030] specific, figure 2 It is a schematic structural diagram of a PCBA sub-board 10 provided in Embodiment 1 of the present application. refer to figure 2 , the two ends of the first edge of the PCBA sub-board 10 are provided with fixed pins 11, the middle of the first edge is provided with a mounting plate, and a first opening 12 is provided between the fixed pins 11 and the mounting plate , the mounting board includes a first welding area 14 and a second welding area 13, both sides of the first welding area 14 and the second welding area 13 are provided with pads 30, the first weld...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a vertically-assembled PCBA board based on wave soldering and an electronic component. The vertically-assembled PCBA board comprises a PCBA daughter board and a PCBA bottom board, fixing pins are arranged at the two ends of the first edge of the PCBA daughter board, a mounting board is arranged in the middle of the first edge, a first opening is formed between the fixing pins and the mounting board, the mounting board comprises a first welding area and a second welding area, bonding pads are arranged on the front face and the back face of the first welding area and the front face and the back face of the second welding area respectively, and a second opening is formed between the first welding area and the second welding area; mechanical holes are formed in the two ends of the PCBA bottom board, a first mounting socket and a second mounting socket are formed in the middle of the PCBA bottom board, bonding pads are arranged on the two sides of the first mounting socket and the two sides of the second mounting socket, and the bonding pads of the PCBA bottom board are metalized half holes; the fixing pins are in interference fit with the mechanical holes, and the PCBA daughter board and the PCBA bottom board which are vertically assembled are welded through wave soldering. By adopting the technical means, the technical problem that traditional vertical welding assembly does not support wave soldering can be solved.

Description

technical field [0001] The embodiment of the present application relates to the field of identification technology, and in particular to a vertical assembly of PCBA boards and electronic components based on wave soldering. Background technique [0002] With the vigorous development of electronic products and PCB manufacturing industry, PCB presents a trend of miniaturization, high speed and high density, which greatly increases the complexity of PCB design. In order to reduce the development cycle, simplify the process and increase the assembly density, the PCBA core board and PCBA base board are often separated, so that the core board can be used in common, and the PCBA base board can be replaced with different resources. The core board and PCBA bottom board of this separate design are usually connected by connectors, parallel soldering assembly or vertical soldering assembly to achieve electrical connection. [0003] The traditional vertical welding assembly method is aff...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/52H01R4/02H05K1/11H05K1/14
CPCH01R4/029H01R12/52H05K1/116H05K1/117H05K1/141
Inventor 周立功段小华王洪昌黄钦宁周会泉
Owner GUANGZHOU ZHIYUAN ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products