Defoaming packaging process of electronic component

A technology for electronic components and packaging technology, applied in the field of defoaming packaging technology, can solve the problems of poor protection effect of electronic components, cracking of epoxy resin layers, etc., to achieve good protection, eliminate voids, and achieve good effects

Active Publication Date: 2021-08-17
深圳市智楠科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, epoxy resin is generally used for encapsulation, but when the epoxy resin is poured, there are often certain air bubbles inside, resulting in certain gaps in the formed epoxy resin layer, resulting in the actual use of the epoxy resin. Layers are prone to cracking, resulting in poor protection for internal electronic components

Method used

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  • Defoaming packaging process of electronic component
  • Defoaming packaging process of electronic component
  • Defoaming packaging process of electronic component

Examples

Experimental program
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Effect test

Embodiment 1

[0046] See figure 1 , An electronic component defoamemic packaging process, including the following steps:

[0047] S1, first install the chip on the substrate, then lay on a layer of breathing moving in the chip;

[0048] S2, the pretreatment of the inner breathing moving ball, and then a layered cast epoxy resin;

[0049] S3, the casting of the epoxy resin of the first layer, after the pouring of the substrate, the internal breathing moving ball is expanded, and the rushing treatment is processed, so that the internal breathing moving ball is restored, and the heating is repeated multiple times. The treatment of rushing, so that the internal respiratory moving ball continues to repeat the expansion-restoration process, exhibiting a "breathing" state, from the inside to the epoxy resin, eliminate the void inside the epoxy resin;

[0050] After S4, the first layer of epoxy resin is cooled and fixed, the casting of the second layer of epoxy resin is carried out, and naturally coole...

Embodiment 2

[0059] See Figure 4-5 The difference from the first embodiment is that the pulley 3 is not provided, and the outer spherical shell 1 is made of an elastic material, and the outer extrusion ball 4 is made of a hard material, so that during heating, internal breathing ball core 2 After expanding, the outer spherical shell 1 is expanded outward after the extrusion of insulating oil, thereby greater the range of vibration of the epoxy resin, and the effect of eliminating voids is better.

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Abstract

The invention discloses a defoaming packaging process of an electronic component, and belongs to the field of electronic component packaging. The defoaming packaging process of the electronic component comprises the following steps: pouring an epoxy resin layer for several times, and laying a layer of internal breathing balls on the electronic component during the first pouring; through heating treatment, expanding the internal breathing movable ball; performing rapid cooling treatment, so the internal breathing movable ball is restored to the original shape; sequentially and repeatedly performing heating and rapid cooling, so the internal breathing movable ball continuously repeats the expansion-recovery process, and the breathing state is presented. Therefore, the epoxy resin is vibrated from the inside, and the situation that air is introduced due to external stirring or external force application is effectively avoided; meanwhile, internal gaps during epoxy resin pouring can be effectively eliminated, it is effectively guaranteed that the first epoxy resin layer on the electronic element is not prone to cracking in the using process; compared with the prior art, the electronic element is better protected, and packaging is completed by pouring the second epoxy resin layer later.

Description

Technical field [0001] The present invention relates to the field of electronic components, and more particularly to an antifoaming packaging process of an electronic component. Background technique [0002] The package is to refer to the circuit pin on the silicon wafer to attach the wire to the external joint to connect to other device. The package form is the outer casing for mounting the semiconductor integrated circuit chip. It not only plays the role of installation, fixing, sealing, protective chip and enhancement electricity, but also connects to the pins of the encapsulated housing by wires on the chip, these pins through the printed circuit board Connect to other devices to connect the internal chip to the external circuit. Because the chip must be isolated from the outside to prevent impurities in the air to reduce electrical performance to the corrosion of the chip circuit. On the other hand, the packaged chip is also more convenient to install and transport. Since th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/67
CPCH01L21/56H01L21/67126
Inventor 汤雪蜂
Owner 深圳市智楠科技有限公司
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