Intelligent preparation method of low-palladium activating agent applied to circuit board hole metallization

Abstract

The invention relates to the technical field of PCB production manufacturing and intelligent processing equipment, in particular to an intelligent preparation method of a low-palladium activating agent applied to circuit board hole metallization. The invention provides an intelligent preparation method of a low-palladium activating agent applied to circuit board hole metallization, which is completed by adopting a reaction kettle in a matching manner and comprises the following steps: 1) weighing 500-1000g of sodium chloride, adding 3L of pure water into the reaction kettle, then adding 10-100g of organic matter hydroquinone, and heating to 60-70 DEG C; (2) adding 400 ml of a 16.8 g / L palladium chloride solution into the reaction kettle, stirring for 10-30 min, and then increasing the temperature to 95 DEG C; according to the invention, the square disc is in full contact with the solution so that palladium chloride on the square disc can be fully mixed with the solution, the residue of palladium chloride on the square disc is reduced, the waste of palladium chloride is reduced, the square disc is cleaned, a metal target can be recycled in a cleaning solution, the waste of raw materials is reduced, and the mixing efficiency is relatively high.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing and intelligent processing equipment, in particular to an intelligent preparation method of a low-palladium activator applied to circuit board hole metallization. Background technique [0002] PCB, the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is produced using electronic printing, it is called a "printed" circuit board. In the process of PCB production, electroless copper plating is required. Electroless copper plating is usually also called copper sinking, which is an autocatalytic redox reaction. Electroless copper plating is widely used in our PCB manufacturing industry. At present, the most widely used is to use electroless copper plating for PCB hole metallization. The electroless copper plating ...

AI Technical Summary

Problems solved by technology

At present, the concentration of colloidal palladium used in the industry is mostly above 50ppm, generally above 80ppmL, and its activity is low. If the concentration of palladium is too low, there will be quality risks such as poor backlight. In the context of the current shortage of metal palladium resources and the skyrocketing price of palladium, A low-palladium activator is needed to reduce the amount of palladium used to reduce costs;

[0003] And when existing to the production of low palladium activator, the adding metering precision of palladium to reactor is low, causes to add too much palladium metal, thereby makes cost difficult to control, and when adding metal palladium, will be on the container Remaining a certain amount of metal target will also lead to the waste of metal palladium, which will increase the cost

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