Steady flow area laser/ultrasonic composite low-damage complex microstructure machining device and method

Abstract

The invention discloses a steady flow area laser/ultrasonic composite low-damage complex microstructure machining device, and belongs to the technical field of precise non-traditional machining. The device comprises a base, a workpiece clamping sliding table unit, a laser unit, a jet gun unit and an upper computer; the workpiece clamping sliding table unit, the laser unit and the jet gun unit are arranged on the base; a workpiece is clamped on the workpiece clamping sliding table unit; An optical axis of laser emitted by the laser unit is in a horizontal state and is perpendicular to the surface of the workpiece, and laser spots achieve high-frequency micro-displacement modification and macroscopic machining track coupling in the direction perpendicular to the optical axis; and a high-pressure water jet participates in laser in high-frequency reciprocating motion to act on the surface of the workpiece at the same time, and attachments on the surface of the machined workpiece are peeled off while a heat affected zone and a recast layer are reduced. According to the device and method, the recast layer on the machined surface is peeled off in real time, the attachments on the machined surface are cleared, and the quality and the subsurface performance of the machined surface are improved.

Description

technical field [0001] The invention belongs to the technical field of precision special processing, and in particular relates to a laser / ultrasonic composite low-damage complex microstructure processing device and method in a steady flow area. Background technique [0002] With the increasing demand for micro parts in the fields of national defense, biotechnology, and medical treatment, its processing technology has become the focus of research in the field of manufacturing. Laser etching provides an efficient, high-precision and easy-to-operate processing method, and can flexibly control laser energy input and laser beam propagation, so it is widely used in the field of micromachining. The traditional laser processing technology achieves the purpose of material removal by absorbing a large amount of heat on the surface of the workpiece to produce phase change (melting, vaporization). However, since the workpiece material near the laser action area will also absorb part of ...

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Problems solved by technology

[0003] In order to solve the problems existing in the prior art, the present invention provides a laser / ultrasonic composite low-damage complex microstructure processing device and method in the steady flow area, which solves the problems in the prior art that it is difficult to meet the requirements of micro-processing and produce pollution, etc.

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