LED circuit board with COB packaging substrate

A technology of LED circuit boards and packaging substrates, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as interference with luminous efficiency, reduced luminous effect, and insufficient heat dissipation, and achieve increased refractive index, improved luminous effect, and improved luminous effect Effect

Inactive Publication Date: 2021-08-24
谢国州
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the existing COB-packaged LED circuit boards still have insufficient heat dissipation when the power is high. Once the heat accumulates

Method used

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  • LED circuit board with COB packaging substrate
  • LED circuit board with COB packaging substrate
  • LED circuit board with COB packaging substrate

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0042] Example 1:

[0043] See figure 1 A LED circuit board with a COB package substrate comprising a metal substrate 1, a metal substrate 1 is connected to a hollow insulating plate 2, and the upper end of the hollow insulating plate 2 is connected to a matching line layer 3, and the upper end connection of the line layer 3 is matched. The coffin 4, the hollow insulating plate 2 is mounted in mounted with multiple chips 6, and the chip 6 is filled with a white adhesive, and the white adhesive is mounted to be connected to the heat dissipation transparent hose 7, and the cofferdam 4 is filled with fluorescent The powder block 8, the lower end of the metal substrate 1 is opened with the heat exchange tanks that match the chip 6, and a plurality of water supply balls 5 connected to the heat dissipation transparent hose 7 are provided.

[0044] See figure 2 The heat dissipation transparent hose 7 includes a center tube 71, the tail pipe 72, and the pipe 73, the center tube 71 is inse...

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PUM

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Abstract

The invention discloses an LED circuit board with a COB packaging substrate, and belongs to the technical field of LED circuit boards. According to the LED circuit board with the COB packaging substrate, after a plurality of water supply balls below a metal substrate sense heat, a part of deformation action is triggered, and therefore deionized water containing fluorescent powder is pressed into a fluorescent powder rubber block through a heat dissipation transparent hose to be distributed; on one hand, the area near the chip can be cooled, a proper temperature range is kept, on the other hand, the deionized reclaimed water mixed with the fluorescent powder can improve the refractive index of light rays, so that the overall light emitting effect is improved, meanwhile, after cooling, the water supply ball recovers the shape, the deionized water flows back again, heat is dissipated to the outside, and then next flow heat dissipation is waited. Compared with the prior art, the method has the advantages that circulating flow of the deionized water is kept through triggering of heat, and the heat dissipation performance and the light emitting effect of the LED circuit board can be effectively improved.

Description

technical field [0001] The invention relates to the technical field of LED circuit boards, in particular to an LED circuit board with a COB packaging substrate. Background technique [0002] The full name of COB packaging is chip-on-board packaging, which is a technology to solve the problem of LED heat dissipation. It is to adhere the bare chip on the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to realize its electrical connection. [0003] LED circuit board is the abbreviation of printed circuit board. Both LED aluminum substrate and FR-4 fiberglass circuit board belong to PCB. To say the difference, just compare LED aluminum substrate and FR-4 fiberglass circuit board. The circuit is printed on the aluminum plane with better thermal conductivity, and then the electronic components are soldered on it. [0004] The main purpose of using aluminum substrate is that it has good heat dissipation. Because high-power LEDs ...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/50H01L33/58H01L33/62H01L33/64
CPCH01L33/48H01L33/50H01L33/62H01L33/647H01L33/648H01L33/642H01L33/58H01L33/641
Inventor 谢国州
Owner 谢国州
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