Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for leaching copper and gold in waste circuit board by utilizing micro-electric field to strengthen phanerochaete chrysosporium

A technology of Phanerochaete chrysosporium and Phanerochaete, which is applied in the field of copper and gold, can solve the problems of lack of systematic and research on the strengthening mechanism, and achieve the effects of promoting fungal growth, increasing enzyme activity, and reducing the pH of the system

Active Publication Date: 2021-08-27
SHANGHAI SECOND POLYTECHNIC UNIVERSITY
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, the research on micro-electric field strengthening method has mostly focused on the effect of micro-electric field stimulation on the appearance of cells, and there is still a lack of systematic research on the strengthening mechanism.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for leaching copper and gold in waste circuit board by utilizing micro-electric field to strengthen phanerochaete chrysosporium
  • Method for leaching copper and gold in waste circuit board by utilizing micro-electric field to strengthen phanerochaete chrysosporium
  • Method for leaching copper and gold in waste circuit board by utilizing micro-electric field to strengthen phanerochaete chrysosporium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] In this example, waste mobile phone circuit boards are processed. The content of the main metal elements is shown in Table 1. The particle size analysis after crushing and sorting shows that the particle size is less than or equal to 1mm. About 84.57%.

[0028] The content of main metal elements in table 1 example 1 waste mobile phone circuit board

[0029]

[0030] 1mL P. chrysosporium (U.S.A NDM3-2) spore suspension was inoculated into a 150mL special electrolytic container containing 50mL of sterilized nitrogen-limited medium, and the number of spores in the spore suspension was 5×10 5 spores / mL, shake culture for 3 days at a culture temperature of 30° C. and a shaker speed of 120 rpm, and the fungus forms dense mycelial balls.

[0031] Add 0.50g of waste mobile phone circuit board powder into the cultured fungal liquid in step (1), the addition amount is 1wt%; After leaching for 6 days, the pH value of the reaction system was maintained between 4.50 and 5.50. ...

Embodiment 2

[0033] In this example, waste computer circuit boards are processed, and the content of the main metal elements is shown in Table 2. The particle size analysis after crushing and sorting shows that the particle size is less than or equal to 1mm and accounts for about 82.76%.

example 2

[0034] The content of main metal elements in table 2 example 2 waste computer circuit board

[0035]

[0036] 2mL P. chrysosporium (U.S.A NDM3-2) spore suspension was inoculated into a 150mL special electrolytic container containing 50mL of sterilized nitrogen-limited medium, and the number of spores in the spore suspension was 3×10 5 spores / mL, shake culture for 4 days at a culture temperature of 35° C. and a shaker speed of 150 rpm, and the fungus forms dense mycelial balls.

[0037] Add 0.75g of waste mobile phone circuit board powder to the cultured fungus liquid in step (1), the addition amount is 1.50wt%; the pH value of the reaction system is adjusted to 5, the rotation speed is 150rpm, and the DC electric field strength is 15mA , leached for 8 days, and the pH value of the reaction system was maintained between 4.50 and 5.50. The leaching rates of basic metals copper, aluminum, lead, zinc, nickel, and cadmium were 73.46%, 53.60%, 42.77%, 57.21%, 65.24%, and 47.56...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Granularityaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of hydrometallurgy, and particularly relates to a method for leaching copper and gold in a waste circuit board by utilizing a micro-electric field to strengthen phanerochaete chrysosporium. The method comprises the following steps: firstly, carrying out self-immobilization culture on phanerochaete chrysosporium; then adding the sterilized waste circuit board powder into an electrolysis container containing cultured fungus liquid, and performing direct-current micro-electric field enhanced leaching for 6-10 days; and finally, recycling copper and gold from the microbiological leaching liquid through an extraction-reverse extraction-electrodeposition method and an activated carbon adsorption method. After the combined action of the micro-electric field and the phanerochaete chrysosporium, the average leaching rates of copper and gold in the waste circuit board are 70.90% and 38.64% correspondingly. In a fungus leaching system without applying the micro-electric field, the average leaching rates of copper and gold of the waste circuit board are 44.54% and 27.53% correspondingly. The method has the advantages that the leaching rate of copper and gold is obviously improved after micro-electric field strengthening, and the leaching period is shortened by at least 4 days.

Description

technical field [0001] The invention belongs to the technical field of hydrometallurgy, and particularly relates to a method for using a micro-electric field to strengthen Phanerochaete chrysosporium for leaching copper and gold from waste circuit boards. Background technique [0002] With economic development and scientific and technological progress, the update speed of electronic products has accelerated, and the output of electronic waste has increased sharply. In 2019, the global output of electronic waste was 53.6 million tons, and my country's was 10.129 million tons, ranking first. As the carrier of electronic components, printed circuit boards are an indispensable part of electronic equipment. Waste circuit boards are typical electronic waste, accounting for about 3% to 6% of electronic waste. In addition to plastics and inert oxides, scrap circuit boards also contain significant amounts of metals. These metals are mainly composed of base metals (such as copper, a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C22B7/00C22B11/00C22B3/18C22B15/00C25C1/12C12P3/00C12N1/14C12N13/00C12R1/645
CPCC22B7/006C22B3/18C22B11/046C22B15/0067C22B15/0084C25C1/12C12P3/00C12N1/14C12N13/00Y02P10/20
Inventor 刘倩白建峰顾卫华王景伟李如燕李慧心唐洲祥余晨胡焮粤
Owner SHANGHAI SECOND POLYTECHNIC UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com