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Semiconductor device

A semiconductor and device technology, applied in the field of semiconductor devices

Inactive Publication Date: 2021-08-31
SONY SEMICON SOLUTIONS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Generally, in a semiconductor device in which a semiconductor chip is mounted on a substrate, there is a problem of how to release heat generated from the semiconductor chip

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0039] [Structure of Semiconductor Device]

[0040] figure 1 is a cross-sectional view showing an example of the structure of the semiconductor device in the embodiment of the present technology.

[0041] In this semiconductor device, an element 200 is mounted on the surface of a silicon substrate 100 serving as a base. The element 200 is a semiconductor chip, and in the following embodiments, is assumed to be a solid-state imaging element. That is, the element 200 is an example of a solid-state imaging element set forth in the claims.

[0042] A predetermined region on the surface of the element 200 mounted on the substrate 100 is selectively bonded to the substrate 100 via the bonding part 190 . Here, the predetermined region refers to a region directly below the heat generating portion 201 called a hot spot (local high temperature portion) of the element 200 . Under normal conditions, since it is designed not to exceed the guaranteed heat-resistant temperature, it is di...

no. 2 approach

[0067] In the first embodiment described above, a case was assumed in which the solid-state imaging element is formed on the same silicon substrate, however, in recent years, a solid-state imaging element formed of a stacked structure is used. Therefore, in the second embodiment, an example assuming a solid-state imaging element having a stacked structure is described.

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PUM

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Abstract

A semiconductor device performs heat exhaust efficiently without loss of imaging characteristics in a solid state imaging element mounted on a substrate. The semiconductor device comprises: a substrate; a solid state imaging element; and an adhesive section that adheres the substrate and the solid state imaging element. The substrate is a substrate comprising metal wiring. The solid state imaging element is mounted on the surface of the substrate. The adhesive section adheres a prescribed region in one surface of the solid state imaging element to the substrate. The adhesive section has a prescribed thermoelectric conductivity, and does heat exhaust of heat generated in the solid state imaging element toward the substrate.

Description

technical field [0001] The present technology relates to a semiconductor device. More specifically, the present invention relates to a semiconductor device in which a solid-state imaging element is mounted on a substrate. Background technique [0002] Generally, in a semiconductor device in which a semiconductor chip is mounted on a substrate, there is a problem of how to release heat generated from the semiconductor chip. For example, there has been proposed a semiconductor package in which a heat generating portion of a semiconductor chip is partially exposed and cooled by being in contact with a heat dissipation member (for example, refer to Patent Document 1). Furthermore, for example, a semiconductor device in which a case of a semiconductor chip and a heat sink are bonded to each other with thermal grease has been proposed (for example, refer to Patent Document 2). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L23/36
CPCH01L23/12H01L23/36H01L27/14618H01L31/024H01L27/14634
Inventor 小山寿树
Owner SONY SEMICON SOLUTIONS CORP