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Heat-conducting gasket and preparation method thereof

A technology of thermally conductive gaskets and thermally conductive fillers is applied in the fields of thermal management materials, thermally conductive interface materials, and thermally conductive and heat-dissipating materials. high coefficient effect

Pending Publication Date: 2021-09-03
CHANGZHOU FUXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, gaskets prepared only with polymer fibers and thermally conductive fillers have weak internal bonding and high hardness. As a result, when two-dimensional sheet-shaped thermally conductive fillers such as graphite powder, graphene, and boron nitride are used, only flat surfaces can be obtained. A gasket with high thermal conductivity in the direction of thickness is not enough to make a gasket with high thermal conductivity in the thickness direction

Method used

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  • Heat-conducting gasket and preparation method thereof
  • Heat-conducting gasket and preparation method thereof
  • Heat-conducting gasket and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Such as Figure 7 As shown, 95wt.% graphite sheet and 5wt.% reinforcing material, wherein the reinforcing material is a polymer filament, can still be directly pressed and formed without a binder, and the formability is good.

Embodiment 2

[0055] In this embodiment, graphene accounts for 50wt.%, polymer filaments account for 0.3wt.%, and liquid silica gel accounts for 49.7wt.%.

[0056] The ratio of graphene sheet size distribution between 10-100 μm and 100-1000 μm is 0.1;

[0057] The high molecular polymer used for wire drawing is PE;

[0058] Liquid silicone is polydimethylcyclosiloxane;

[0059] High speed shear drawing rate 50000r / min; shear time 0.5min;

[0060] After adding liquid silica gel and mixing thoroughly, the thickness of the prepared sheet is 0.2mm;

[0061] The curing temperature is 150°C;

[0062] After testing, the thermal conductivity of the sample is 15.4W / (m K), and the application thermal resistance and compression resilience results of samples with different thicknesses are shown in Table 1:

[0063] Table 1

[0064] Thickness (mm) Applied Thermal Resistance (K in 2 / W)

Embodiment 3

[0066] In this embodiment, graphene accounts for 90wt.%, polymer filaments account for 2wt.%, and liquid silica gel accounts for 8wt.%.

[0067] The ratio of graphene sheet size distribution between 10-100μm and 100-1000μm is 9.0;

[0068] The high molecular polymer used for wire drawing is PP;

[0069] Liquid silicone is polydimethylsiloxane;

[0070] High-speed shearing machine shearing and drawing speed 1000r / min; shearing time 6min;

[0071] After adding liquid silica gel and mixing thoroughly, the thickness of the prepared sheet is 3mm;

[0072] The curing temperature is 120°C;

[0073] After testing, the thermal conductivity of the sample is 47.3W / (m K), and the application thermal resistance and compression resilience results of samples with different thicknesses are shown in Table 2:

[0074] Table 2

[0075]

[0076]

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Abstract

The invention provides a heat-conducting gasket, which comprises a heat-conducting filler and a reinforcing material. The heat-conducting filler is a two-dimensional heat-conducting filler arranged along the thickness direction of the heat-conducting gasket, and the reinforcing material is filaments formed by high-molecular polymer wire drawing and / or carbon filaments formed by heat treatment of the filaments formed by high-molecular polymer wire drawing. The two-dimensional heat-conducting filler is tightly connected by the polymer filaments and / or the carbon filaments to form a filler / polymer and / or filler / carbon filament network structure.

Description

technical field [0001] The invention relates to the technical fields of heat conduction and heat dissipation materials, heat conduction interface materials, heat management materials, etc., and in particular relates to a heat conduction pad and a preparation method thereof. Background technique [0002] In electronic devices such as 5G base stations, notebook computers, and high-power LED displays, the radiator can dissipate the heat generated by the heating element in time, thus ensuring the operation stability of the electronic devices. In most cases, a thermal pad is required between the heating element and the heat sink to reduce the interface thermal resistance. With the substantial increase in the power of electronic devices, ordinary thermal pads (thermal conductivity below 10W / m / K) are far from meeting the heat dissipation requirements. Patent document JP6646836B2 discloses the use of flat graphite powder for orientation to prepare high thermal conductivity gaskets....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14C08L83/04C08L23/06C08K3/04C08L23/12C08L25/06C08L77/00C08L83/08C08L27/18C08L55/02C08L67/02C08K7/00C08L27/16C08L59/02C08L71/12C08L81/06H05K7/20
CPCC09K5/14C08L83/04C08L83/08H05K7/20509C08L2205/16C08L23/06C08K3/042C08L23/12C08L25/06C08L77/00C08L27/18C08L55/02C08L67/02C08K3/04C08K7/00C08L27/16C08L59/02C08L71/12C08L81/06
Inventor 葛翔李峰李壮石燕军周步存
Owner CHANGZHOU FUXI TECH CO LTD
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