Method for preparing metal support monomer by adopting magnetron sputtering method
A metal support, magnetron sputtering technology, applied in sputtering plating, metal material coating process, ion implantation plating, etc., can solve the problem of high resistance, high working temperature, inability to apply MS-SOC, and low electrocatalytic activity and other problems, to achieve the effect of small resistance, improved electrocatalytic activity and volume power density
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Embodiment 1
[0086] To prepare the fuel electrode layer, sputter Ni metal and yttrium-stabilized zirconia as target materials of the fuel electrode layer onto the porous metal support provided in the embodiment of the present invention. Ni metal and yttrium stabilized zirconia (YSZ) dense ceramic material are used as targets, Ni metal adopts direct current (DC) sputtering mode, YSZ adopts radio frequency (RF) sputtering mode, control DC sputtering power DC to 30W, RF sputtering The radiation power is 100W, and the gas is O 2 Mixed gas with Ar, the gas ratio is 1 / 5, the gas flow rate is 10sccm, the pressure in the sputtering chamber is 1Pa, the temperature of the metal support substrate is 300°C, the rotation speed of the metal support substrate is 12rpm, the metal support substrate and the fuel electrode layer The distance between the targets is 2 cm, the sputtering time is 100 min, and the thickness of the obtained fuel electrode layer is 20 nm.
[0087] The electrolyte layer was prepare...
Embodiment 2
[0091] To prepare the fuel electrode layer, sputter Ni metal and yttrium pick alloy as target materials of the fuel electrode layer onto the porous metal support provided in the embodiment of the present invention. Using Ni metal and yttrium pick alloy as the target material, Ni metal and yttrium pick alloy adopt direct current (DC) sputtering mode, control the DC sputtering power DC to 50W, and use O as the gas 2 Mixed gas with Ar, O 2 The ratio of the gas to Ar is 1 / 5, the gas flow rate is 100 sccm, the pressure in the sputtering chamber is 1Pa, the temperature of the metal support substrate is 300°C, the rotation speed of the metal support substrate is 12rpm, and the distance between the metal support substrate and the fuel electrode layer target 6cm, the sputtering time is 60min, and the thickness of the obtained fuel electrode layer is 80nm.
[0092] Prepare the electrolyte layer, use yttrium pick alloy as the target material, adopt DC sputtering mode, DC sputtering powe...
Embodiment 3
[0096] To prepare the fuel electrode layer, sputter Ni metal and yttrium-stabilized zirconia as target materials of the fuel electrode layer onto the porous metal support provided in the embodiment of the present invention. Ni metal and yttrium stabilized zirconia (YSZ) dense ceramic material are used as targets, Ni metal adopts direct current (DC) sputtering mode, YSZ adopts radio frequency (RF) sputtering mode, control DC sputtering power to 200W DC, RF sputtering The radiation power is 300W, and the gas is O 2 Mixed gas with Ar, O 2 The ratio of the gas to Ar is 1 / 5, the gas flow rate is 120 sccm, the pressure in the sputtering chamber is 10Pa, the temperature of the metal support substrate is 600°C, the rotation speed of the metal support substrate is 20rpm, and the distance between the metal support substrate and the fuel electrode layer target 15cm, the sputtering time is 20h, and the thickness of the obtained fuel electrode layer is 5μm.
[0097] The electrolyte layer...
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Abstract
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