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Collimating film, interference-reducing collimating film, laminated collimating film, hole-sealing laminated collimating film and preparation method thereof

A straight hole and fit technology, applied in the field of image recognition, can solve the problem of difficult alignment of two layers of collimating diaphragms

Active Publication Date: 2021-09-10
NINGBO EXCITON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of difficult alignment of two layers of collimating diaphragms in traditional rigid collimating sheets, the present invention provides a collimating film, a collimating film for reducing interference, a bonding type collimating film, and a sealing Bonded collimation film and its preparation method, and an image recognition module and its preparation method
The collimating film provided by the present invention only includes one layer of collimating holes, which solves the problem of difficult alignment of two layers of collimating diaphragms

Method used

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  • Collimating film, interference-reducing collimating film, laminated collimating film, hole-sealing laminated collimating film and preparation method thereof
  • Collimating film, interference-reducing collimating film, laminated collimating film, hole-sealing laminated collimating film and preparation method thereof
  • Collimating film, interference-reducing collimating film, laminated collimating film, hole-sealing laminated collimating film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0211] like Image 6 The display is shown in the present invention, including the collimating lens layer 41, the flexible substrate layer 42, and the collisional, the collimated lens layer is placed on the upper surface of the substrate, the collimated hole layer is placed in the lower surface of the substrate. The aligned direct lens layer 41 includes a microbial array 41a and a thickness 41b, and the pore layer 43 includes a collimated pore array formed after the light-shielding medium 43a and the dielectric hollow (constitute a certain number of quantity pores 43b); The thickness T of the flexible matrix layer is 25 μm. The collimated lens arrays and collimated pore arrays are closely arranged in a normal triangle array (eg Figure 8 Indicated). The main optical axis of the microlens is 18 μm, the radius of curvature R is 12.6 μm, the collimation lens layer thickness H is 8.5 μm, and the thickness T of the straight hole layer is 2 μm, the collimated hole diameter φ is 4 μm. . The...

Embodiment 2-24

[0220] As shown in Example 1, the collimated lens array and the collimated pore array in the collimator are closely arranged in a positive triangle, and the material of the straight lens layer 41 is PMMA, the flexible matrix layer 42. The light shielding medium 43a of the colored hole layer 43 is the inorganic coating, which is collected by the microlens in a microbial punch. The other parameters are listed in Table 1.

[0221] Table 1 Examples 1 to 24 design parameters and optical properties

[0222]

[0223]

[0224] Note 1: P is the minimum spacing of the main optical axis of the microlens, the unit μm; R is the radius of curvature of the microlens, the unit μm; H is the thickness of the collimation lens layer, the unit μm; N1 is the refractive index of the collimation lens layer, no quantity The unit; T is the thickness of the flexible matrix layer, the unit μm; N2 is the refractive index of the flexible matrix layer, and the dimensiony unit; D is a spot diameter formed on...

Embodiment 25-30

[0227] As shown in Example 1, the column of the straight film is closely arranged in a positive triangle, and the material of the straight lens layer 41 is a material of PMMA and a material of the flexible matrix. For the PET, the light shielding medium 43a of the collimating hole layer 43 is a inorganic coating carbide, the ratio of the metallic film, which is collected by the microlens, and the other parameters are listed in Table 2.

[0228] Table 2 Embodiments 25 to 30 design parameters and optical properties

[0229]

[0230]

[0231] Note 1 with Table 1.

[0232] As shown in Table 2, embodiments 25 to 30 are different from different flexible substrates. Examples 25 to 27 are p = 10 μm, and the other parameter is unchanged, T = 10, 15, 20 μm is a set of quasi-metallic films, and Examples 28 to 30 are P = 25 μm, respectively, and other parameters constant Next, T = 25, 38, 50 μm is another set of quasi-straight film. When t is increasing, in order to keep the microsocratic...

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Abstract

The invention belongs to the field of image recognition, and particularly relates to a collimating film, an interference-reducing collimating film, a laminated collimating film, a hole-sealing laminated collimating film and a preparation method thereof. In order to solve the problem of bubbles of a laminated collimating film designed by adopting a relatively thick light shielding layer, the invention provides the collimating film, the interference-reducing collimating film, the laminated collimating film, the hole-sealing laminated collimating film and the preparation method thereof. The hole-sealing laminated collimating film comprises a collimating lens layer, a flexible substrate layer, a collimating hole layer and a laminating adhesive layer, wherein the collimating lens layer comprises a micro-lens array and a lens layer; the collimating hole layer is a collimating through path layer, and the collimating through path layer comprises a columnar collimating through path array and a shading medium. The hole-sealing laminated collimating film provided by the invention is applied to an image recognition module, so that the recognition accuracy of the image recognition module is high.

Description

Technical field [0001] The present invention belongs to the field of image recognition, and more particularly to a collimator film, a reduction of the diaphragm, a bonding collimation film, a sealing bonding type quasi-static film and its preparation method thereof. Background technique [0002] In the field of image recognition, commonly used image sensors such as CMOS or Photo-TFT types, generally contain collimated devices in the sensor module to enhance signal-to-noise ratio, improve the identification, and reduce crosstalk. The function of collimating devices (such as figure 1 As shown, it is primarily that the diffused light at the image single point pixel is collimated, the collimation light or close to the collimated light (signal), which can be smoothly transmitted, and the deviation method The large angular light (noise) can only be very least even unable to enter the non-corresponding photoactive device, thereby reinforcing it. [0003] Color devices typically have top...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B27/30G02B3/00G02B1/10G06K9/00
CPCG02B3/0037G02B3/0006G02B3/00G02B1/10G02B27/30C09J7/29Y02E10/549Y02P70/50
Inventor 李刚夏寅付坤高斌基刘建凯陈建文唐海江张彦
Owner NINGBO EXCITON TECH
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