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Cleaning method for laser forming metal circuit

A metal circuit and laser forming technology, applied in the cleaning/polishing of conductive patterns, secondary treatment of printed circuits, etc., can solve problems such as increasing the risk of short circuits

Pending Publication Date: 2021-09-10
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the problem that micro-sodium-sized metal particles are dispersed into the entire circuit due to the conventional ultrasonic cleaning method, thereby increasing the risk of short circuit, and to provide a cleaning method for laser-formed metal circuits

Method used

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  • Cleaning method for laser forming metal circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A cleaning method for laser forming metal circuits, such as figure 1 shown, including the following steps:

[0029] On a 10x10mm PI organic carrier plate, a nano-copper particle coating with a particle size of 50nm and a thickness of 25μm is coated. Line shaping is performed using a 355nm UV laser. Soak the circuit forming carrier board in 10% mass fraction hydrogen peroxide solution for 5 seconds, then soak in 5% mass fraction dilute sulfuric acid solution for 5 seconds, and then soak in ethanol solution for 5 seconds. Repeat 3 times until the residual nano-copper particles are completely removed. Afterwards, the circuit carrier is put into a chromate solution for passivation treatment, and the cleaning of the circuit is completed. After cleaning, the surface of the circuit carrier board is smooth and clean without residual nano-copper particles.

Embodiment 2

[0031] A cleaning method for laser forming metal circuits, such as figure 1 shown, including the following steps:

[0032] On a 10x10mm FR-4 organic carrier plate, a coating of nano-copper-silver mixed particles with a particle size of 50nm and a thickness of 25μm is coated. Use 1064nm infrared laser for line forming. Place the circuit-forming carrier board in a 50% oxygen environment and keep warm at 180° C. for 2 hours. Then soak in 5% mass fraction dilute sulfuric acid solution for 5 seconds, and then soak in ethanol solution for 5 seconds. Put into 30% oxygen environment again, carry out 150 ℃ insulation for 1 hour. Then soak in 5% mass fraction dilute sulfuric acid solution for 5 seconds, and then soak in ethanol solution for 5 seconds. until the residual nano-copper particles are completely removed. Afterwards, the circuit carrier is put into a chromate solution for passivation treatment, and the cleaning of the circuit is completed. After cleaning, the surface of ...

Embodiment 3

[0034] A cleaning method for laser forming metal circuits, such as figure 1 shown, including the following steps:

[0035] On a 10x10mm PI organic carrier plate, a coating of nano-gold particles with a particle size of 50nm and a thickness of 25μm was coated. Line shaping is performed using a 355nm UV laser. Soak the circuit forming carrier board in 5% mass fraction potassium permanganate solution for 2 seconds, then soak in 5% mass fraction dilute hydrochloric acid solution for 5 seconds, and then soak in propanol solution for 5 seconds. Repeat 3 times until the residual gold nanoparticles are completely removed. Afterwards, the circuit carrier is put into a chromate solution for passivation treatment, and the cleaning of the circuit is completed. After cleaning, the surface of the circuit carrier board is smooth and clean without residual gold nanoparticles.

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PUM

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Abstract

The invention discloses a cleaning method for a laser forming metal circuit. The method comprises the following steps: S1, carrying out oxidation treatment on a laser forming metal circuit carrier plate with residual micro-nano-sized metal particles, and enabling the residual metal particles to form metal oxides; S2, carrying out acid pickling on the circuit carrier plate treated in the step S1, and removing residual metal oxides; and S3, detecting the residual metal particles on the circuit carrier plate, repeating the step S1 and the step S2 until the residual metal particles are completely removed, and completing cleaning. According to the invention, oxidation treatment and acid pickling are sequentially carried out on a circuit carrier plate with residual unsintered metal particles, so that the residual metal particles after laser forming of the circuit are thoroughly eliminated; and the method is simple to operate, green and environment-friendly, and has a wide application prospect.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, and more specifically, to a cleaning method for laser-formed metal circuits. Background technique [0002] With the development of electronic and electrical products in the direction of ultra-large-scale integration, digitization, and mass production, traditional printed circuit manufacturing methods include chemical methods and template (or screen) printing methods. , it is easy to bring large errors to high-density and high-precision printed circuit boards; the minimum line width and line spacing are greatly limited, and during the corrosion process, disconnections often occur, especially in large-scale motor computers. High-density multilayer printed boards, due to the high wiring density and thin printed lines, are more prone to corrosion and disconnection at individual positions, resulting in a large amount of waste of precious metals and man-hours. At present, some domestic ent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/26
CPCH05K3/26
Inventor 杨冠南崔成强童金张昱
Owner GUANGDONG UNIV OF TECH