Preparation method of nano-silver powder with high sintering activity

A technology of nano-silver powder and sintering activity, which is applied in metal processing equipment, transportation and packaging, etc. It can solve the problems of inability to sinter nano-silver and stabilize its properties, and achieve the effect of shortening the sintering temperature, increasing the sintering temperature and prolonging the sintering time

Active Publication Date: 2022-03-08
深圳市宏博信息科技有限公司
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Problems solved by technology

[0003] For this reason, the present invention provides a kind of preparation method of nano-silver powder with high sintering activity, which can solve the technical problem that the properties of sintered nano-silver cannot be stabilized by controlling the particle size of nano-silver

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  • Preparation method of nano-silver powder with high sintering activity
  • Preparation method of nano-silver powder with high sintering activity
  • Preparation method of nano-silver powder with high sintering activity

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Embodiment Construction

[0043] In order to make the objects and advantages of the present invention clearer, the present invention will be further described below in conjunction with the examples; it should be understood that the specific examples described here are only for explaining the present invention, and are not intended to limit the present invention.

[0044] Preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present invention, and are not intended to limit the protection scope of the present invention.

[0045] It should be noted that, in the description of the present invention, terms such as "upper", "lower", "left", "right", "inner", "outer" and other indicated directions or positional relationships are based on the terms shown in the accompanying drawings. The direction or positional relationship shown is ...

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Abstract

The invention relates to a preparation method of nano-silver powder with high sintering activity, comprising: step S1, injecting nano-silver into the first grinding device through a first grinding device feed port for preliminary grinding; step S2, preliminarily grinding nano-silver The second grinding device is injected into the second grinding device through the feed port of the second grinding device and is ground again by the high-pressure airflow, and the nano-silver meeting the particle size is injected into the sintering device through the discharge port of the second grinding device; step S3, the central control unit controls the sintering device, and Nano silver is sintered. In the present invention, by setting the central control unit, according to the unqualified rate of nano-silver particle size obtained, the volume change rate during sintering, the sintering temperature and the sintering time, the output of sintered nano-silver meets the preset standard, and at the same time, the jet flow is adjusted. The frequency, the grinding time of the first grinding device and the dynamic parameters of the power device are used to make the particle size of the love nano-silver meet the preset standard.

Description

technical field [0001] The invention relates to the field of nano silver preparation, in particular to a preparation method of nano silver powder with high sintering activity. Background technique [0002] In the field of microelectronic packaging, the third-generation semiconductor materials represented by SiC and GaN have unique properties such as large band gap, high breakdown voltage, high thermal conductivity, and good chemical stability, making them suitable for use in optoelectronic devices, high In the field of printed electronics, ink printing technology has been widely used in many fields such as solar cells 111121, organic LEDII31, organic thin film transistors 1141 and wearable electronic devices 1151. In recent years, there have been many researches on the application of nano silver particles in the field of microelectronic packaging or printed electronics technology. High, can overcome the defects of traditional solder interconnection, but at present, because ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/04B22F3/10B22F1/054
CPCB22F9/04B22F3/10B22F2009/041B22F2301/255
Inventor 邢家辉黄毓桦
Owner 深圳市宏博信息科技有限公司
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