Unlock instant, AI-driven research and patent intelligence for your innovation.

Vapor chamber preparation method, vapor chamber and electronic equipment

A technology of vapor chamber and heat conduction plate, which is applied in the direction of lighting and heating equipment, electrical equipment structural parts, electrical components, etc., and can solve problems such as insufficient etching ability, insufficient capillary force of capillary grooves, and great influence on etching ability. Achieve the effects of improving heat dissipation, enhancing stability, and increasing flow speed

Active Publication Date: 2021-09-28
江西新菲新材料有限公司
View PDF16 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the related technology, the capillary grooves are mainly formed by etching on the vapor chamber, but this method is greatly affected by the etching ability. Insufficient etching ability will easily lead to the width of the capillary grooves formed by etching is not small enough, and the capillary grooves of the capillary grooves Insufficient power will affect the heat dissipation effect of the vapor chamber

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vapor chamber preparation method, vapor chamber and electronic equipment
  • Vapor chamber preparation method, vapor chamber and electronic equipment
  • Vapor chamber preparation method, vapor chamber and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] see figure 1 , figure 2 , figure 1 It is a schematic diagram of a partial structure of a vapor chamber, figure 2 It is a partial structural schematic diagram of another vapor chamber. Embodiment 1 of the present invention discloses a vapor chamber 10, which includes a plate body 1, the plate body 1 is provided with a plurality of capillary grooves 11, at least one capillary groove 11 is provided with a capillary structure 2, and the capillary structure 2 is used for To increase the capillary force of the capillary groove 11, the capillary structure 2 includes inorganic oxide particles, and the inorganic oxide particles are fixed on the inner wall surface of the capillary groove 11 after drying.

[0038] In related technologies, vapor chambers mostly use the following two methods: One of the vapor chambers uses copper mesh sandwiched in the plate body, and the flow of liquid working fluid is realized through the capillary force of the copper mesh to achieve the heat...

Embodiment 2

[0058] see image 3 , image 3 A flow chart of a method for preparing a vapor chamber is shown. Embodiment 2 of the present invention discloses a method for preparing a vapor chamber, which is used to prepare the vapor chamber 10 of Embodiment 1 above. Specifically, the preparation method includes:

[0059] 201: Setting multiple capillary grooves on the plate body.

[0060] Compared with installing a copper mesh in the body of the vapor chamber to realize the flow of the liquid working medium in the body of the vapor chamber to achieve the heat dissipation effect of the vapor chamber, the preparation method of the vapor chamber in this embodiment is achieved by adding A plurality of capillary grooves 11 are provided to realize the flow of liquid working medium in the plate body 1 to realize the heat dissipation effect of the vapor chamber 10, so that the thickness of the vapor chamber 10 can be thinner to meet the light and thin design of the electronic device 100 demand.

...

Embodiment 3

[0082] see Figure 4 , Figure 4 It is a structural block diagram of the electronic device disclosed in the embodiment of the present application. Embodiment 3 of the present invention discloses an electronic device 100, which includes a heating element 20 and a soaking plate 10, the soaking plate 10 is the soaking plate 10 as described in the first embodiment above, and the heating element 20 is attached to the soaking plate 10.

[0083]Specifically, the electronic device 100 may include, but is not limited to, a smart phone, a smart watch, a tablet computer, a handheld game console, and the like. The heating element 20 may be an electronic device in the electronic device 100 that emits heat during operation, and may include, for example, a battery, a chip (or a motherboard), a camera, a flashlight, a speaker, and the like. In actual installation, since the heating element 20 is located inside the electronic device 100, correspondingly, the vapor chamber 10 is also arrange...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a preparation method of a vapor chamber, the vapor chamber and electronic equipment. The preparation method of the vapor chamber comprises the steps that a plurality of capillary grooves are formed in a plate body; and a capillary structure is arranged in at least one capillary groove so as to increase the capillary force of the capillary groove, the capillary structure comprises inorganic oxide particles, and the inorganic oxide particles are dried and fixed to the inner wall faces of the capillary grooves. By adopting the mode, the capillary structure comprising the inorganic oxide particles is arranged on the inner wall surface in the capillary groove, so that the stability of the capillary structure can be enhanced, the capillary force of the capillary groove can be enhanced, and the heat dissipation effect of the vapor chamber can be enhanced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a preparation method of a vapor chamber, a vapor chamber, and electronic equipment. Background technique [0002] With the development of science and technology, the processing functions of electronic devices in electronic equipment are becoming more and more powerful, and the power consumption and heat generation of electronic equipment are also increasing. In related technologies, in order to take into account the light and thin design of electronic equipment, VC (Vapor Chamber, vacuum chamber heat dissipation technology) vapor chambers are often used to dissipate heat from electronic devices (such as chips, batteries, etc.). [0003] In the related technology, the capillary grooves are mainly formed by etching on the vapor chamber, but this method is greatly affected by the etching ability. Insufficient etching ability will easily lead to the width of the capillary gr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F28D15/04
CPCH05K7/20336F28D15/046Y02D10/00
Inventor 江峰
Owner 江西新菲新材料有限公司