Lithographic equipment and silicon wafer pre-alignment method

A lithography equipment and pre-alignment technology, which is applied in optics, instruments, photoplate-making process of patterned surface, etc., can solve the problems of low efficiency, affecting the movement travel time and station handover efficiency, time-consuming problems, etc., to achieve Reduce process time, improve handover efficiency and flexibility, and improve efficiency

Active Publication Date: 2021-10-01
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The rotation axis R and the lifting axis Z are set coaxially, and they are restrained from each other and cannot move independently. The flexibility i

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  • Lithographic equipment and silicon wafer pre-alignment method
  • Lithographic equipment and silicon wafer pre-alignment method
  • Lithographic equipment and silicon wafer pre-alignment method

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[0040] Based on the above research, embodiments of the present invention provide a lithography apparatus, especially a silicon wafer pre-alignment device and a pre-alignment method therein. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are in a very simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.

[0041]An embodiment of the present invention provides a lithography apparatus, including: an exposure device, a mask stage device, a workpiece stage device, and a silicon wafer transfer device; wherein the silicon wafer transfer device includes a silicon wafer pre-alignment device, and the silicon wafer The pre-alignment devi...

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Abstract

The invention provides photoetching equipment and a silicon wafer pre-alignment method. A silicon wafer pre-alignment device comprises a bottom plate, a translation unit, a lifting unit, a rotating unit and an optical acquisition system. The rotating unit and the lifting unit are independently arranged, rotating motion and lifting motion are separated, and the motion stroke efficiency is improved. The rotating unit is arranged on the translation unit, and the translation unit drives the rotating unit to translate, so that on one hand, eccentricity compensation of the silicon wafer is realized; on the other hand, the transverse distance between the rotating unit and the optical acquisition system is adjustable so as to adapt to different silicon wafer sizes. The lifting motion and the rotating motion are parallel, the pre-alignment process string changing motion is partially parallel, the process time is shortened, and the efficiency is improved. The lifting unit drives a second suction cup to do lifting motion, so that the vertical distance between a first suction cup on the rotating unit and the second suction cup on the lifting unit is adjustable, more working conditions can be met, and the connection efficiency and flexibility of corresponding stations of the rotating unit and the lifting unit are improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment, and in particular relates to a photolithography equipment and a silicon chip pre-alignment method. Background technique [0002] A lithographic apparatus is a machine that applies a predetermined pattern to a silicon wafer substrate. Photolithographic equipment is widely used in the manufacture of integrated circuits (ICs). During the production process of the lithography process, the silicon wafer needs to be transferred to the workpiece table of the lithography equipment with high centering and orientation accuracy through a silicon wafer transmission mechanism (such as a robot arm), so that the silicon wafer can be fixed in a fixed position. pose for exposure. Since the position and direction of the silicon wafer are uncertain when it is initially placed, it is required to pre-align the silicon wafer with a certain precision before the silicon wafer is transferred to the work...

Claims

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Application Information

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IPC IPC(8): G03F9/00
CPCG03F9/7019G03F9/7088
Inventor 王刚
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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