Control method of semiconductor packaging control system

A technology of control system and control method, applied in the direction of control system, vector control system, control electromechanical brake, etc., to achieve the effect of ensuring performance and improving suppression ability

Active Publication Date: 2021-10-01
东莞普莱信智能技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the technical problems of linear

Method used

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  • Control method of semiconductor packaging control system
  • Control method of semiconductor packaging control system
  • Control method of semiconductor packaging control system

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0260] Example 1

[0261] According to a particular embodiment of the invention, the step of establishing a transfer function of the semiconductor package control system of the present invention will be described in detail.

[0262] According to a specific embodiment of the invention, the transfer function of the establishment of a special interference observer is established includes the following steps:

[0263] According to the principle of interference observer, an interference observer is established, including the following steps:

[0264] Set U is a reference input with an interference observer basic model, its value is a speed acceleration forward-looking k af s 2 K vf s 2 Output G PID (s) the sum;

[0265]Set D is the system low frequency interference, ξ is high frequency interference, Q (S) is a filter, g V (s) is the established control kernel model, Is the control object nominal model G n (s) reverse, y is the system output;

[0266] Taking n (s) = g V (s). When actua...

Example Embodiment

[0283] Example 2

[0284] According to a specific embodiment of the present invention, the step of establishing a curing control kernel function based on a linear motor mathematical model, a current loop, and a velocity ring, and the control method of the semiconductor package control system of the present invention will be described in detail.

[0285] Curing the Curing Control Core Function Based on Linear Motor Mathematical Model, Current Ring and Speed ​​Rings V (s) The specifically includes the following steps:

[0286] Establish the mathematical model of the straight motor platform in the control system, the formula is as follows:

[0287]

[0288] in,

[0289] G M Control the output of the straight motor platform;

[0290] L is a linear electric electromechanical pivot (unit: MH);

[0291] R is a linear electromechanical electrical resistance (unit: Ω);

[0292] K f Is a linear motor constant (unit: n / a);

[0293] M is a linear motor movement quality (unit: kg);

[0294...

Example Embodiment

[0324] Example 3

[0325] According to a particular embodiment of the invention, the control method of the semiconductor package control system of the present invention is based on the curing control kernel function G. V (s), the step of establishing a position ring transfer function using PID control will be described in detail.

[0326] Curing control kernel function g V (s), establish a line transfer function using PID control, including the following steps:

[0327] The PID control expression of the position ring is:

[0328]

[0329] Establish transfer function G using PID control position ring PID (S) is:

[0330]

[0331] in,

[0332] K pp The proportional coefficient of the position ring;

[0333] K pi The integral coefficient of the position ring;

[0334] K pd The differential coefficient of the position ring;

[0335] G p Output of the location;

[0336] Di 4 = K pp B 2 ;

[0337] Di 3 = K pp B 2 + K pd B 1 ;

[0338] Di 2 = K pp B 1 + K pi B 2 + K pd B 0 ;

[0339]...

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Abstract

The invention provides a control method of a semiconductor packaging control system, which belongs to the technical field of semiconductors. Firstly, a position loop, a speed loop and a current loop are controlled based on PID/PI/PI, on the basis, a control object, the current loop and the speed loop serve as a control whole, acceleration and speed feedforward are added to the position loop to improve the system response capacity and guarantee the target tracking characteristic performance, meanwhile, a specific disturbance observer is also added to the position loop, the suppression capability of internal interference and external interference is improved, and the performance of external interference suppression characteristics is realized.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a control method for a semiconductor packaging control system. Background technique [0002] In the manufacture of integrated circuits, miniaturized, multi-pin, and fine-pitch chips have extremely high requirements on the servo performance, positioning accuracy, and positioning time of the motion control system of packaging equipment. Run smoothly and accurately to a given target position. However, in the process of high-speed and high-precision point-to-point motion with fast start and stop, external disturbances, mechanical resonance and nonlinear factors of the control system itself all affect the servo performance of the system to varying degrees, directly affecting the positioning of the packaging equipment control system Accuracy and positioning time, so the system servo control strategy is the core difficulty of the chip packaging control system. [0003] In the C...

Claims

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Application Information

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IPC IPC(8): H02P21/13H02P23/12H02P6/00H02P7/02H02P25/06
CPCH02P21/13H02P23/12H02P6/006H02P7/02H02P25/06
Inventor 田兴银张勇毛军
Owner 东莞普莱信智能技术有限公司
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