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Epoxy resin high-thermal-conductivity composite material and preparation method thereof

A technology of epoxy resin and composite material, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of the decline of mechanical properties of composite materials with thermal conductive filler filling amount, and achieve good process operability, maintain insulation properties, mechanical properties, etc. The effect of improved performance

Pending Publication Date: 2021-10-26
李静文
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessive filling of thermally conductive fillers will inevitably lead to a decrease in the mechanical properties of composites

Method used

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  • Epoxy resin high-thermal-conductivity composite material and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0020] (1) Add 2g of boron nitride nanotubes into 5mol / L NaOH solution, stir and reflux at 120°C for 24h, centrifuge, wash and dry;

[0021] (2) Prepare the boron nitride nanotubes treated in the above step (1) into a 2g / L aqueous dispersion of boron nitride nanotubes, and then add aminopropyltrimethoxysilane with a mass ratio of 2%, 80 Stir and reflux at ℃ for 12h, centrifuge, wash and dry;

[0022] (3) The aminopropyltrimethoxysilane-modified boron nitride nanotubes prepared in step (2) were dispersed in acetone by high-speed stirring, and then 14.4g of bisphenol A epoxy resin and 3.6g of aromatic amine curing agent were added, Ultrasonic treatment for 70 minutes to obtain a boron nitride nanotube dispersion;

[0023] (4) Heat and vacuum the dispersion liquid prepared in step (3) to remove acetone and air bubbles, and finally carry out thermal curing reaction. The heat curing condition is 80°C for 24 hours at a constant temperature, and then 130°C for 12 hours to obtain a ...

Embodiment 2

[0026] (1) Add 1g of boron nitride nanotubes to 5mol / L NaOH solution, stir and reflux at 120°C for 12h, centrifuge, wash and dry;

[0027] (2) Prepare the boron nitride nanotubes treated in the above step (1) into a 1g / L aqueous dispersion of boron nitride nanotubes, and then add aminopropyltrimethoxysilane with a mass ratio of 1%, 80 Stir and reflux at ℃ for 12h, centrifuge, wash and dry;

[0028] (3) The aminopropyltrimethoxysilane-modified boron nitride nanotubes prepared in step (2) were dispersed in acetone by high-speed stirring, and then 15.2g of bisphenol F epoxy resin and 3.8g of aromatic amine curing agent were added, Ultrasonic treatment for 60 minutes to obtain a boron nitride nanotube dispersion;

[0029] (4) Heat and vacuum the dispersion liquid prepared in step (3) to remove acetone and air bubbles, and finally carry out thermal curing reaction. The heat curing condition is 80°C for 24 hours at a constant temperature, and then 130°C for 12 hours to obtain a co...

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Abstract

The invention provides a boron nitride nanotube-epoxy resin high-thermal-conductivity composite material and a preparation method thereof. The composite material is composed of boron nitride nanotubes, epoxy resin and a curing agent, the boron nitride nanotubes are amino propyl trimethoxy silane modified boron nitride nanotubes, and the mass fraction of the boron nitride nanotubes is 0.5-10%. The preparation method of the composite material is simple, has good in process operability, and achieves the purpose of achieving high thermal conductivity by filling a small amount of thermal conductive filler. The prepared composite material has outstanding high heat-conducting property, mechanical property and insulating property.

Description

technical field [0001] The invention relates to the field of thermally conductive composite materials, in particular to a boron nitride nanotube-epoxy resin high thermally conductive composite material and a preparation method thereof. Background technique [0002] Epoxy resin is widely used in electrical equipment insulation and microelectronic equipment packaging due to its excellent adhesion, dielectric properties and processability. However, the thermal conductivity of pure epoxy resin is very low, only about 0.2 W / (m K). Therefore, in order to improve the heat dissipation ability of epoxy resin, epoxy resin must be modified to improve its thermal conductivity. [0003] At present, the particle filling method is mostly used at home and abroad to improve the thermal conductivity of epoxy resin, that is, to add inorganic fillers with high thermal conductivity, such as oxides (Al 2 o 3 , SiO 2 and ZnO), carbides (SiC) and nitrides (AlN and BN), etc. However, in order t...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K7/24C08K3/38C09K5/14
CPCC08K9/06C08K7/24C08K3/38C09K5/14C08K2201/003C08K2201/004C08K2003/385C08K2201/014C08L63/00
Inventor 李静文
Owner 李静文
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