Epoxy resin high-thermal-conductivity composite material and preparation method thereof

A technology of epoxy resin and composite material, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of the decline of mechanical properties of composite materials with thermal conductive filler filling amount, and achieve good process operability, maintain insulation properties, mechanical properties, etc. The effect of improved performance

Pending Publication Date: 2021-10-26
李静文
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Problems solved by technology

Excessive filling of thermally conductive fillers will inevitab

Method used

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  • Epoxy resin high-thermal-conductivity composite material and preparation method thereof

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[0019] Example 1:

[0020] (1) 2 g of boron nitride nanotubes were added to 5 mol / l NaOH solution, and stirred at 120 ° C for 24 h, centrifuged, washed, dried;

[0021] (2) The boron nitride nanotubes processed after the above step (1) were equipped with 2 g / L of boron nitride nanopube water dispersion, and then added with a mass ratio of 2% aminopropyltrimethoxysilane, 80 The mixture was stirred in ° C for 12 h, centrifuged, washed, and dried;

[0022] (3) The aminopropyltrimethoxysilane-modified boride nanoplatine-modified boride nanoplasts prepared by step (2) is distracted in acetone through high speed, and then 14.4 g of bisphenol A epoxy resin and 3.6 g of an aromatic amine curing agent. Ultrasound treatment 70min, gave a boron nitride nanotube dispersion;

[0023] (4) The dispersion prepared by step (3) is heated vacuum extra gas treatment, removes acetone and bubble, and finally the thermoset reaction is performed. The thermosetting conditions were 80 ° C constant temp...

Example Embodiment

[0025] Example 2:

[0026] (1) 1 g of boron nitride nanotubes were added to 5 mol / l NaOH solution, and stirred at 120 ° C for 12 h, centrifuged, washed, dried;

[0027] (2) The boron nitride nanotubes processed after the above step (1) are prepared from 1 g / L of boron nitride nanopubrite dispersion, then the mass ratio of 1% aminopropyltrimethoxysilane, 80 The mixture was stirred in ° C for 12 h, centrifuged, washed, and dried;

[0028] (3) The aminopropyltrimethoxysilane-modified boron nitride nanoplasts prepared by step (2) is distracted in acetone through high speed, and then 15.2 g of bisphenol F epoxy resin and 3.8 g of an aromatic amine curing agent, Ultrasound treatment for 60 min to give boron nitride nanotube dispersion;

[0029] (4) The dispersion prepared by step (3) is heated vacuum extra gas treatment, removes acetone and bubble, and finally the thermoset reaction is performed. The thermosetting conditions were 80 ° C constant temperature for 24 h, and then at a c...

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Abstract

The invention provides a boron nitride nanotube-epoxy resin high-thermal-conductivity composite material and a preparation method thereof. The composite material is composed of boron nitride nanotubes, epoxy resin and a curing agent, the boron nitride nanotubes are amino propyl trimethoxy silane modified boron nitride nanotubes, and the mass fraction of the boron nitride nanotubes is 0.5-10%. The preparation method of the composite material is simple, has good in process operability, and achieves the purpose of achieving high thermal conductivity by filling a small amount of thermal conductive filler. The prepared composite material has outstanding high heat-conducting property, mechanical property and insulating property.

Description

technical field [0001] The invention relates to the field of thermally conductive composite materials, in particular to a boron nitride nanotube-epoxy resin high thermally conductive composite material and a preparation method thereof. Background technique [0002] Epoxy resin is widely used in electrical equipment insulation and microelectronic equipment packaging due to its excellent adhesion, dielectric properties and processability. However, the thermal conductivity of pure epoxy resin is very low, only about 0.2 W / (m K). Therefore, in order to improve the heat dissipation ability of epoxy resin, epoxy resin must be modified to improve its thermal conductivity. [0003] At present, the particle filling method is mostly used at home and abroad to improve the thermal conductivity of epoxy resin, that is, to add inorganic fillers with high thermal conductivity, such as oxides (Al 2 o 3 , SiO 2 and ZnO), carbides (SiC) and nitrides (AlN and BN), etc. However, in order t...

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K7/24C08K3/38C09K5/14
CPCC08K9/06C08K7/24C08K3/38C09K5/14C08K2201/003C08K2201/004C08K2003/385C08K2201/014C08L63/00
Inventor 李静文
Owner 李静文
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