Silicon optical chip end face coupling structure resistant to high input optical power
An end-face coupling, silicon optical chip technology, applied in the directions of light guides, optics, optical components, etc., can solve the problems of large nonlinear loss of silicon waveguides, increase coupled optical power, and decrease in transmittance, and achieve low coupling loss and reduction. The effect of low loss and thermo-optic coefficient
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[0032] The following description and drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments.
[0033] like Figure 1-10 As shown, in some illustrative embodiments, a silicon-optical chip end-face coupling structure resistant to high input optical power is provided, which can realize high optical power input and multiple outputs on a silicon-based optical chip, including: an end-face coupling unit 10. The first connection unit 40 , the power splitting unit 20 , the second connection unit 50 , the conversion unit 30 , and the third connection unit...
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