Control method for improving warping of aluminum-based mixed compression structure laminated board and PCB
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A control method and technology for PCB boards, which are used in laminated printed circuit boards, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve problems such as inconsistent expansion and shrinkage changes, affecting product flatness, and prone to board warping and exceeding the standard.
Active Publication Date: 2021-11-02
HUIZHOU KING BROTHER CIRCUIT TECH +1
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[0002] At present, automotive power module products are mainly based on thick copper core board laminated aluminum base structure, relying on surface copper, hole copper, high thermal conductivity bonding sheet and metal aluminum base to achieve rapid heat conduction of the product, because the metal aluminum base and copper core board are Two materials with different physical properties, when pressed at high temperature, their expansion and contraction changes are inconsistent, and board warpage is easily exceeded (warping degree ≥ 1.5%), which affects product flatness and has a potential impact on customer follow-up placement quality
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Embodiment 1
[0098] Embodiment 1: A control method for improving the warping of aluminum-based mixed-compression structure laminates, including
[0099] S1. Laminate structure optimization, select the aluminum base 100 and the inner core plate 200 with preset thickness and hardness, so that the thickness ratio of the aluminum base 100 and the core plate dielectric layer 210 in the inner core plate 200 is 10:1;
[0100] S2. Fabrication of inner core board;
[0101] S3. Production of aluminum-based components. After the aluminum-based 100 is cut, the aluminum-based 100 is pre-hot-pressed once by a conventional hot-pressing method; the parameters of the conventional hot-pressing method are: the furnace temperature is 140°C, and the heating rate is 1.8°C-2.2 ℃ / min, pressure 30 kg -40kg / cm2, 200 ℃ heat preservation and pressing ≥ 60min.
[0102] S4, pressing, pressing the inner core board 200 and the aluminum base 100 together with a vacuum laminator;
[0103] S5, plate warping leveling treat...
Embodiment 2
[0116] Embodiment 2: A control method for improving the warping of aluminum-based mixed-compression structure laminates, including
[0117] S1. Laminate structure optimization, select the aluminum base 100 and the inner layer core board 200 with preset thickness and hardness, so that the thickness ratio of the aluminum base 100 and the core board dielectric layer 210 in the inner layer core board 200 is 15:1;
[0118] S2. Fabrication of inner core board;
[0119] S3. Production of aluminum-based components. After the aluminum-based 100 is cut, the aluminum-based 100 is pre-hot-pressed once by the rapid hot-pressing method; the parameters of the rapid hot-pressing method are: the furnace temperature is 160°C-200°C, and the heating rate is 5 ℃-10℃ / min, pressure 30kg-40kg / cm2, heat preservation and pressing at 200℃ for 20min.
[0120] S4, pressing, pressing the inner core board 200 and the aluminum base 100 together with a vacuum laminator;
[0121] S5, plate warping leveling t...
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Abstract
The invention discloses a control method for improving warping of an aluminum-based mixed compression structure laminated board, which comprises the following steps of: optimizing a laminated structure to ensure that a thickness ratio of an aluminum-based core board dielectric layer to a core board dielectric layer in an inner core board is more than or equal to 10:1; manufacturing the inner-layer core plate; manufacturing an aluminum-based component, namely, after cutting the aluminum-based component, carrying out hot pressing on the aluminum-based component once in advance; pressing, namely pressing the inner-layer core plate and an aluminum base together by adopting a vacuum laminating machine; conducting plate warping leveling treatment, specifically, after pressing is conducted, conducting leveling treatment by a plate warping leveling machine; carrying out X-Ray targeting; ceramic grinding; manufacturing an outer-layer circuit; performing acid etching; carrying out resistance welding; forming a character; performing gold immersion; carrying out e-T testing; forming CNC appearance; and inspecting a finished product. The aluminum base and the inner core plate with preset thickness are selected, so that the whole PCB is lighter and thinner, the warpage of the PCB is reduced, the high-pressure-resistant requirement of the PCB can be met, hot pressing is performed once by using a high-temperature press (200 DEG C) in advance, the thermal stability of the aluminum base is improved, the hot-pressing expansion and shrinkage change of the aluminum base is reduced, and the high-flatness requirement of a customer on a product is met.
Description
technical field [0001] The invention relates to the technical field of PCB boards, in particular to a control method and a PCB board for improving the warpage of aluminum-based mixed-press structure laminated boards. Background technique [0002] At present, automotive power module products are mainly based on thick copper core board laminated aluminum base structure, relying on surface copper, hole copper, high thermal conductivity bonding sheet and metal aluminum base to achieve rapid heat conduction of the product, because the metal aluminum base and copper core board are When two materials with different physical properties are pressed together at high temperature, their expansion and contraction changes are inconsistent, and board warpage is easily exceeded (warping degree ≥ 1.5%), which affects the flatness of the product and has a potential impact on the quality of the customer's subsequent placement. Contents of the invention [0003] Based on this, it is necessary...
Claims
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Application Information
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