Universal cold plate for airborne punch-through liquid cooling module

A liquid-cooled channel and liquid-cooled technology, which is applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating modification, electrical components, etc., can solve problems such as difficulties in cold plate design and flow resistance matching

Pending Publication Date: 2021-11-05
10TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of the above-mentioned difficulty in designing the cold plate of the through liquid cooling modul

Method used

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  • Universal cold plate for airborne punch-through liquid cooling module
  • Universal cold plate for airborne punch-through liquid cooling module
  • Universal cold plate for airborne punch-through liquid cooling module

Examples

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Embodiment Construction

[0015] refer to Figure 1-Figure 3 , in the embodiment described below, an airborne pass-through liquid cooling module universal cold plate, including: a pass-through liquid-cooled module box body 5 integrated with a liquid-cooled cold plate on the plug-in, fixed on the pass-through liquid-cooled module box The LRM liquid cooling transfer connector 1 on the flow channel cover plate of the body 5, and the microchannel cold plate 2 with a liquid cooling flow channel inside. The two ends of the liquid-cooled channel of the micro-channel cold plate 2 are connected through the external fluid LRM liquid-cooled transfer connector 1 to form a closed loop of the internal fluid liquid-cooled channel in which the liquid working fluid flows inside the micro-channel cold plate 2, and then through the LRM liquid-cooled The transfer connector 1 is connected to the liquid cooling circulation system of the on-board liquid cooling equipment; the flow of fluid in the arc-shaped flow channel form...

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Abstract

The invention discloses an universal cold plate for an airborne punch-through liquid cooling module. According to the universal cold plate, the heat dissipation requirement of the module can be met, the component arrangement and flow resistance matching of themodule are facilitated. According to the technical schemes of the invention, an arch-shaped flow channel is formed by U-shaped opening flow channels around a liquid cooling channel; heat exchange pipes which are fixed in the middle of a micro-channel cold plate and are arranged in parallel are surrounded in the micro-channel cold plate; and an LRM liquid cooling adapter connector connected with an external liquid cooling source penetrates through fluid through a flow channel of the micro-channel cold plate to form a secondary heat exchange liquid cooling channel taking away heat; and the heat exchange pipe parallel to a cooling liquid flow direction exchanges heat with a cooling liquid flow channel connected with the heat exchange pipe, liquid pressure vapor flow around the heat insulation exchange pipe wall of the evaporation heating end of the heat exchange pipe is instantly vaporized,the vapor flow flows towards a condensation end under traction of pressure, a large amount of heat is released, heat of a high-heat area in the middle of the LRM module is quickly diffused to a low-heat liquid cooling flow channel region, so that the heat of the component of the LRM module is taken away and dissipated.

Description

technical field [0001] The invention relates to a design technology of electronic device equipment and airborne small-scale liquid cooling equipment, especially in avionics equipment with many key tasks, and an airborne through liquid cooling module universal cold plate used for airborne environmental equipment. Background technique [0002] As the heat flux density of electronic equipment increases, the heat dissipation design of electronic components is becoming more and more important in the design of electronic equipment, and may even become a key factor for further integration of equipment. During 90% to 95% of the actual flight envelope, the electronic components should control the junction temperature below 90°C, and at the same time require the module to have good temperature uniformity to reduce thermal stress. In order to achieve this goal, different means of air cooling system and efficient heat dissipation measures are adopted at home and abroad, of course, liqui...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20509H05K7/20336
Inventor 吴伟黄文强张宗安
Owner 10TH RES INST OF CETC
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