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Polyamide-imide resin composition and production method for polyamide-imide resin

A technology of polyamide-imide resin and polyamide-imide, which is applied in the direction of epoxy resin coatings and coatings, and can solve problems such as use restrictions, reduced resin solubility, and reduced adhesion of coating films

Active Publication Date: 2021-11-05
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, the use of NMP has been gradually restricted from the viewpoint of environmental protection regulations. Therefore, it is desired to reduce the amount of NMP used that is not expected under environmental regulations, or to manufacture polyamide-imide resins without using NMP.
[0005] On the other hand, for example, polyamide-imide resins manufactured using polar solvents other than NMP, such as DMAC, tend to lower the adhesion of the coating film compared to polyamide-imide resins manufactured using NMP.
In addition, since conventional methods for producing polyamideimide resins usually require heating at 120°C or higher, and as the number average molecular weight (Mn) of polyamideimide resins obtained by polymerization reactions increases, , the solubility of the resin will decrease, the fluidity of the reaction solution will deteriorate, etc., and it is desired to improve work efficiency

Method used

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  • Polyamide-imide resin composition and production method for polyamide-imide resin
  • Polyamide-imide resin composition and production method for polyamide-imide resin
  • Polyamide-imide resin composition and production method for polyamide-imide resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0130] Put 250.3g (1.00mol) of 4,4'-diphenylmethane diisocyanate, 192.1g (1.00mol) of trimellitic anhydride, and 660g of 3-methoxy-N,N-dimethylpropionamide (DMPA) into 2 liters in the flask. While stirring the charged raw materials, the temperature was raised to 100° C., and the reaction was carried out at this temperature for 7 hours to obtain a solution containing a polyamide-imide resin. The polyamideimide resin had a number average molecular weight of 18,900 and a degree of dispersion of 2.3. 8.7 g of methyl ethyl ketone oxime was added to this solution, and it was made to react at 90 degreeC for 2 hours, and the solution A of the terminal-blocked polyamide-imide resin was obtained.

Embodiment 2

[0132] Put 250.3g (1.00mol) of 4,4'-diphenylmethane diisocyanate, 192.1g (1.00mol) of trimellitic anhydride, and 660g of 3-methoxy-N,N-dimethylpropionamide (DMPA) into 2 liters in the flask. While stirring the charged raw materials, the temperature was raised to 100° C., and the temperature was maintained to react for 7.5 hours to obtain a solution containing a polyamide-imide resin. The polyamide-imide resin had a number average molecular weight of 19,700 and a degree of dispersion of 2.4. 6.1 g of ethanol and 4.3 butyl vinyl ether were added to this solution, and it was made to react at 80 degreeC for 2 hours, and the solution B of polyamide-imide resin whose terminal was blocked was obtained.

Embodiment 3

[0134] 150.2 g (0.6 mol) of 4,4'-diphenylmethane diisocyanate, 105.7 g (0.4 mol) of 3,3'-dimethyl-4,4'-diisocyanatobiphenyl, and 192.1 g (0.4 mol) of trimellitic anhydride ( 1.0 mol) and 672 g of 3-methoxy-N,N-dimethylpropionamide (DMPA) were put into a 2-liter flask. While stirring the charged raw materials, the temperature was raised to 100° C., and the temperature was maintained to react for 7.5 hours to obtain a solution containing a polyamide-imide resin. The polyamideimide resin had a number average molecular weight of 18,300 and a degree of dispersion of 2.2. 8.7 g of methyl ethyl ketoxime and 4.3 butyl vinyl ether were added to this solution, and it was made to react at 80 degreeC for 2 hours, and the solution C of polyamide-imide resin whose terminal was blocked was obtained.

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Abstract

A polyamide-imide resin composition that includes a polyamide-imide resin and a solvent that contains a compound that is represented by formula (1). (In the formula, R1 is a C1-C8 alkyl group, R2 and R3 are each independently a hydrogen atom or a C1-C8 alkyl group, and X is a C1-C8 alkylene group).

Description

technical field [0001] The present disclosure relates to a polyamide-imide resin composition and a method for producing the polyamide-imide resin. Background technique [0002] Polyamide-imide resins are widely used in various applications because they are excellent in heat resistance, chemical resistance, and solvent resistance. For example, polyamide-imide resins having an aromatic ring are used to constitute paints for various substrates, such as varnishes for enameled wires, heat-resistant paints, and paints for sliding members. [0003] In paints containing polyamide-imide resins, epoxy resins may be added for the purpose of improving low-temperature curability and mechanical strength (see, for example, Patent Document 1). However, even if the conventional paint can be cured at low temperature, it is difficult to obtain a coating film having sufficiently satisfactory adhesion, and further improvement is desired. [0004] In addition, conventionally, polyamide-imide re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/14C08K5/20C08L63/00C09D7/63C09D179/08
CPCC08K5/20C08G73/14C09D179/08C08L63/00C09D163/00C08G59/44C08G73/1032C08L79/08C09D7/63
Inventor 齐藤康之高桥笃佐竹丽
Owner RESONAC CORPORATION