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Method and device for automatically optimizing copper foil and grouting hole of power supply to increase current stability

An automatic optimization and stability technology, applied in electrical digital data processing, CAD circuit design, special data processing applications, etc., can solve problems such as unfamiliar power specifications, insufficient PCB burning current, and failure to meet power requirements. , to achieve the effect of improving the number of filling holes and copper foil area, highlighting substantive characteristics and reducing inspection time

Inactive Publication Date: 2021-11-09
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The project changed personnel. Because the new engineer was not familiar with the power supply specification, he did not meet the power supply requirement during the modification process, which resulted in PCB burning and insufficient current.

Method used

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  • Method and device for automatically optimizing copper foil and grouting hole of power supply to increase current stability
  • Method and device for automatically optimizing copper foil and grouting hole of power supply to increase current stability

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Embodiment Construction

[0050] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0051] Such as figure 1 As shown, the embodiment of the present invention provides a method for automatically optimizing the copper foil and filling hole of the power supply to increase the current stability, including the following steps:

[0052] Step 11: collect relevant information of the device during PCB layout;

[0053] Step 12...

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Abstract

The invention provides a method and a device for automatically optimizing a copper foil and a grouting hole of a power supply to increase current stability. The method comprises the following steps: collecting related information of a device during wiring of a PCB (Printed Circuit Board); matching an execution module according to the collected information; triggering the execution module to detect the copper foil current magnitude and the grouting current magnitude and output a detection result; and according to a detection result, inputting a modification parameter to trigger the execution module to automatically optimize the width of the copper foil and the number of grouting holes. The current stability is improved by automatically optimizing the copper foil and the grouting holes of the power supply, so that the inspection time spent by engineers during design change can be shortened, the design specification requirements can be met, and engineers of other departments do not need to inspect one by one according to the problem; a layout / wiring engineer can effectively and accurately detect the magnitude of current and improve the number of grouting holes and the area of copper foil through the program, and manual inspection can be greatly reduced to avoid project revision caused by human negligence of the engineer.

Description

technical field [0001] The invention relates to the technical field of PCB power wiring design, in particular to a method and a device for automatically optimizing copper foil and filling holes of a power supply to increase current stability. Background technique [0002] During the server R&D process, the layout / wiring is constantly modified to meet the signal quality requirements of customers and various departments. Whether it is a motherboard or a small card, as long as there are any modifications including (mechanism board type, schematic diagram update, device movement / deletion, Replacement of device materials, etc.), the layout / wiring engineer needs to reconfirm. [0003] The most important thing in the PCB design process is to ensure the quality of the current output / input. The reasons for the insufficient current include the power input terminal, the power output terminal, the width of the copper foil, the thickness of the copper foil, and the number of filling hole...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/394G06F30/398G06F115/12
CPCG06F30/394G06F30/398G06F2115/12
Inventor 曾睿承
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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