The invention relates to a
reusable packaging structure for a substrate, a rewiring layer or an adapter plate, which comprises a first electric connection surface and a second electric connection surface, electric wiring
layers and substrate insulating media are arranged between the first electric connection surface and the second electric connection surface in a laminated and staggered manner, the two electric wiring
layers are communicated through an electric
interconnection hole, and the substrate insulating media are arranged between the first electric connection surface and the second electric connection surface. The first electric connection surface is connected with a first functional
chip and an
interconnection dummy
chip, the first functional
chip is electrically connected with the
interconnection dummy chip through a first lead-out wire, and the interconnection dummy chip is connected to a
solder ball of the second electric connection surface through a second lead-out wire. When the function of a designed and processed
system-in-
package chip is changed, a first functional chip passes through a first
salient point, a first electric connection surface, a second
salient point and an internal lead of an interconnection dummy chip in sequence through the interconnection dummy chip; and the other second bump, the first electric connection surface, the second electric connection surface and the
solder ball form an external complete
signal link of the first functional chip, so that the redesign of the substrate, the rewiring layer or the adapter plate is avoided.