Silica gel composite heat insulation plate and cutting equipment thereof

A heat insulation board and cutting technology, applied in the direction of stone processing equipment, stone processing tools, work accessories, etc., can solve the problems of deformation and bending of the protective iron plate, failure to achieve the protective effect, damage to the bracket, etc., to ensure stable cutting The effect of improving the cutting adaptability and prolonging the replacement cycle

Pending Publication Date: 2021-11-16
南通亿日自动设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the increasing power of laser cutting equipment, the protection of the original frame of the equipment has always been a problem that is difficult to solve perfectly, because some lasers will directly hit the equipment frame during laser cutting and cause equipment damage.
[0003] Most of the existing laser cutting equipment OEMs choose to use iron plates for protection, and then attach a layer of 5mm iron plates to the frame that can be hit by the laser. At present, there are problems with the iron plate protection: 1. For high-power machine tools, the laser is still Can break through the protective iron plate and hurt the bracket
2. When the iron plate is not broken down, it will be heated locally, which will cause the protective iron plate to deform and bend, and the protective effect cannot be achieved
3. The iron plate is replaced at a fixed cycle, and the maintenance cost of the user's equipment is high

Method used

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  • Silica gel composite heat insulation plate and cutting equipment thereof
  • Silica gel composite heat insulation plate and cutting equipment thereof
  • Silica gel composite heat insulation plate and cutting equipment thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] like figure 1 As shown, the silicon condensate composite heat insulation board includes the following raw materials in weight percentage: 58% of aluminum oxide, 5% of silicon dioxide, 1% of calcium oxide, 6% of zirconia, 10% of high-alumina porcelain, 20% of high-alumina alum %.

[0058] The processing technology of silicon condensate composite heat insulation board, the specific steps are as follows:

[0059] Step 1, Al2O3, silicon dioxide, calcium oxide, zirconia, high-alumina porcelain and high-alumina alum are weighed according to the above ratio, and then added to a mixer with a mixer speed of 800r / min and a stirring time of 45min to obtain slurry;

[0060] Step 2. Pour the slurry into the forming mold, then put the filled mold on the vibrating table, shake out the air bubbles, place it on a drying rack to dry, and remove the mold after drying;

[0061] Step 3: After removing the formwork, use the size requirements according to the needs, and cut them by a cutting...

Embodiment 2

[0063] like figure 1 As shown, embodiment 2 is a further improvement to embodiment 1. The silicon condensate composite heat insulation board includes the following raw materials in weight percentage: 55% of aluminum oxide, 7% of silicon dioxide, 2% of calcium oxide, zirconia 8%, high alumina porcelain 13%, high alumina alum 20%.

[0064] The processing technology of silicon condensate composite heat insulation board, the specific steps are as follows:

[0065] Step 1, Al2O3, silicon dioxide, calcium oxide, zirconia, high-alumina porcelain and high-alumina alum are weighed according to the above ratio, and then added to a mixer with a mixer speed of 800r / min and a stirring time of 45min to obtain slurry;

[0066] Step 2. Pour the slurry into the forming mold, then put the filled mold on the vibrating table, shake out the air bubbles, place it on a drying rack to dry, and remove the mold after drying;

[0067] Step 3: After removing the formwork, use the size requirements acc...

Embodiment 3

[0070] Embodiment 3 is a further improvement to Embodiment 1.

[0071] like Figure 1-8 As shown, the cutting equipment of the silicon condensate composite heat insulation board is the cutting machine in step 3, including the frame 1 and the control box 2;

[0072] Frame 1 is connected with a driving structure for moving the silicon solidified composite heat insulation board;

[0073] The driver structure includes:

[0074] The feeding component is installed on one end of the frame 1;

[0075] The feeding assembly includes a first conveyor belt 8 and a first driving roller 28 , the inner wall of the frame 1 is rotatably connected to the first driving roller 28 through a bearing, and the outer wall of the first driving roller 28 is movably connected to the first conveyor belt 8 .

[0076] The first driving assembly, the first driving assembly is installed on the side wall of the frame 1, and the feeding assembly is coaxially fixedly connected with the output end of the first...

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Abstract

The invention discloses a silica gel composite heat insulation plate and cutting equipment thereof, and relates to the technical field of laser cutting. The silica gel composite heat insulation plate comprises the following raw materials in percentage by weight: 55-60% of aluminum oxide, 5-7% of silicon dioxide, 1-2% of calcium oxide, 6-8% of zirconium oxide, 10-15% of high-alumina porcelain and 20-25% of high-alumina alum. According to the scheme, the prepared silica gel composite heat insulation plate is excellent in heat insulation performance, the silica gel composite heat insulation plate and laser cannot be directly broken down by the laser, and a support is prevented from being damaged; higher-strength sintering can be formed after high-temperature direct laser radiation, deformation and bending are avoided, and the protection effect is achieved; and after long-term use, a burning pit is formed on the surface, the pouring material can be normally used only by refilling the pouring material into the pit point, the replacement period is prolonged, the cost is reduced, and meanwhile, feeding and discharging are facilitated.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to a silicon solidified composite heat insulation board and cutting equipment thereof. Background technique [0002] With the increasing power of laser cutting equipment, the protection of the original frame of the equipment has always been a problem that is difficult to solve perfectly, because some lasers will directly hit the equipment frame during laser cutting and cause equipment damage. [0003] Most of the existing laser cutting equipment OEMs choose to use iron plates for protection, and then attach a layer of 5mm iron plates to the frame that can be hit by the laser. At present, there are problems with the iron plate protection: 1. For high-power machine tools, the laser is still It can penetrate the protective iron plate and damage the bracket. 2. If the iron plate is not broken down, it will be heated locally, which will cause the protective iron plate to deform an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B1/087B28D1/24B28D7/00B28D7/04C04B30/00
CPCB28B1/087B28D1/24B28D7/04B28D7/005B28D7/00C04B30/00
Inventor 宗泽许鑫
Owner 南通亿日自动设备有限公司
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