Temperature monitoring and management method and system for reflow oven in ICT production line

Abstract

The invention provides a temperature monitoring and management method and system for a reflow oven in ICT production line. The system comprises a plurality of sensors, a KIC thermodetector, a reflow oven temperature monitoring module, a temperature prediction model, a reaction curved surface model and an assembly oven temperature curve platform. The plurality of sensors are used for acquiring the air speed, the temperature and the conveying belt speed in the reflow oven; the temperature prediction model obtains a predicted temperature curve according to a KIC furnace temperature curve obtained by a KIC thermodetector; the reaction curved surface model adjusts the temperature of a reflow furnace temperature zone according to the correlation between the input variable and the output variable and the difference between the output variable and a suggested set value; and the assembling furnace temperature curve platform is used for presenting a temperature curve and carrying out pushing early warning on events exceeding set upper and lower limit values. Through algorithm modeling prediction, the problems of inaccurate temperature monitoring and high difficulty of the reflow oven in the assembly process are solved, the production process of the reflow oven is finally controlled, the product quality is ensured, the production cost is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of temperature monitoring and management of a reflow furnace, in particular to a method and system for monitoring and managing the temperature of a reflow furnace in an assembly process. Background technique [0002] In printed circuit board assembly using surface mount components, an optimized reflow profile is one of the core factors to obtain high quality solder joints. The temperature profile is the temperature applied to the assembly as a function of time. When plotted in the Cartesian plane, a curve is formed representing the temperature at a specific point on the PCB at any given time scale during the reflow process. [0003] The existing common furnace temperature curve setting method is: [0004] 1. Reflow oven temperature test. Solder the temperature sensor to the corresponding test point of the PCB according to the operating specifications and operating procedures of the furnace temperature meas...

AI Technical Summary

Problems solved by technology

[0008] 1. Manual testing requires high standardization and standardization of operations;

[0009] 2. For the continuous use of the furnace temperature thermometer and the use of thermocouple consumables, the consumption of the thermometer is very large;

[0010] 3. Furnace temperature curve verification has hysteresis, sampling is delayed, and does not represent all process control data. Once the furnace temperature exceeds the range, all product spherical surfaces will be defective before the next test;

[0011] 4. The sampling method of the furnace temperature thermometer cannot be related to the data of each finished product, and there is a risk of continuous defective products;

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