Semiconductor wafer defect detection equipment and detection method

Abstract

The invention relates to the technical field of wafer detection, and in particular relates to semiconductor wafer defect detection equipment and a detection method. The semiconductor wafer defect detection equipment provided by the invention comprises a detection platform on which a wafer to be detected is placed; the detection equipment further comprises an imaging device which comprises an industrial camera, an optical head and an imaging light source, the optical head is arranged at the front end of the industrial camera, the industrial camera is used for collecting a scanning image of the surface of the wafer, and the optical head is used for carrying out scanning imaging on the surface of the wafer; the detection equipment further comprises a wafer transmission device which is used for transmitting the wafer to the detection platform; the detection equipment further comprises a control device which is used for controlling the detection platform and the imaging device and constructing different imaging detection modes, so that the imaging light source provides illumination for the surface of the wafer according to the set imaging detection mode; the detection equipment further comprises an image processing device which is used for receiving the scanned image, carrying out defect detection on the scanned image, and then selecting an optimal imaging detection mode from different imaging detection modes according to an analysis result of defect detection.

Description

technical field [0001] The present application relates to the technical field of wafer detection, in particular to a semiconductor wafer defect detection device and detection method. Background technique [0002] Wafer refers to the wafer used to make silicon semiconductor circuits, and its raw material is usually silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. In the wafer fabrication process, a series of processes such as single crystal pulling, slicing, grinding, polishing, layer buildup, photolithography, doping, heat treatment, and scribing may cause defects on the wafer surface. In order to prevent defective wafers from flowing into the packaging process, it is necessary to use optical inspection equipment to identify wafer surface defects and classif...

AI Technical Summary

Problems solved by technology

[0003] After the current wafer inspection equipment completes the scan, it usually only has the inspection results under a single imaging condition, or cannot complete the imaging under different conditions in one scan

At the same time, there are differences in the number and position of defect points (including false detection defect points or missed detection defect points) detected under different imaging conditions, resulting in unclear wafer characteristics and detection effects

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