Heterojunction infrared photoelectric sensor and preparation method thereof
A photoelectric sensor, electrical sensor technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of low detection and responsivity, low dark current, limited weak light sensing applications, etc., to improve sensitivity and detection. The effect of improving the efficiency of separation and transmission, promoting collection and transmission,
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Embodiment 1
[0028] This embodiment introduces a heterojunction infrared photoelectric sensor.
[0029] Such as figure 1 and figure 2 The heterojunction infrared photoelectric sensor shown uses a photoelectric sensor based on Cu / SnSe / Ge / In-Ga heterojunction; the SnSe / Ge heterojunction is used as the light-absorbing active layer, and the crystal thin film of SnSe and Ge It has a high absorption of infrared light, and forms an electric field at the interface of the SnSe / Ge heterojunction, which helps the rapid separation of photogenerated carriers inside the device, thereby significantly improving the formation of photocurrent and reducing the reverse The saturation current intensity improves the ability of the device to detect weak light; the Cu microgrid structure is used as the top electrode to form an ohmic contact with the SnSe crystal film, which is beneficial to the collection and transmission of photogenerated holes; the In-Ga alloy or In The crystal thin film of Ge acts as the bo...
Embodiment 2
[0035] This example introduces a preparation method of a heterojunction infrared photoelectric sensor.
[0036] Using an N-type single crystal Ge substrate with a resistivity of 1.0-5.0 Ω cm and a thickness of 100-200 μm as a substrate, the Ge crystal substrate is cleaned sequentially in detergent, alcohol, acetone, and alcohol solutions using ultrasonic cleaning equipment. slice for 30min, then pass through dry nitrogen (N 2 ) to dry the substrate to obtain a Ge substrate with a clean surface. Subsequently, using the physical vapor deposition (PVD) method, using high-purity (99.999%) SnSe powder as the growth source, a layer with a thickness of about 70nm and a resistivity of about 2.20×10 3 Ω·cm P-type layered SnSe crystal film, thereby preparing a SnSe / Ge heterojunction with an electrical rectification ratio of up to 200; during the growth process, the evaporation growth temperature is 600°C, the working pressure is 25Pa, and the working gas is argon (Ar), the flow rate i...
Embodiment 3
[0039] This example introduces a preparation method of a heterojunction infrared photoelectric sensor.
[0040] Using an N-type single crystal Ge substrate with a resistivity of 1.0-5.0 Ω cm and a thickness of 100-200 μm as a substrate, the Ge crystal substrate is cleaned sequentially in detergent, alcohol, acetone, and alcohol solutions using ultrasonic cleaning equipment. slice for 30min, then pass through dry nitrogen (N 2 ) to dry the substrate to obtain a single crystal Ge substrate with a clean surface. Using the method of magnetron sputtering, a high-purity (99.999%) SnSe target is used as a sputtering source, and a layered SnSe crystal film with a thickness of 70nm is sputtered on a Ge substrate; the diameter of the target is 50.8mm , the sputtering power is 50W, the working pressure is 10Pa, the working gas is argon (Ar), the flow rate is 50 sccm, and the sputtering time is controlled at about 20 minutes. Subsequently, using a rapid annealing furnace, in high-purity...
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Abstract
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