Method for processing pressure relief hole of earphone by using laser
A technology of laser processing and pressure relief holes, which is applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of high production cost, high loss and high cost of earphones, and achieve high cost performance, low cost, and thermal impact of processing. small effect
Pending Publication Date: 2021-11-26
HANS LASER TECH IND GRP CO LTD
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Problems solved by technology
[0004] The purpose of the present invention is to solve the problem that the existing method for processing pressure relief holes on earphones cannot process microholes with a precision of 0.1mm-0.2mm, and the use of high-precision drills has high cost, low efficiency and large loss, which leads to the production cost of earphones High shortcomings, provide a method of using laser processing earphone pressure relief hole
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[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0022] see Figure 1-Figure 4 , which is a method of using laser to process the earphone pressure relief hole provided by the present invention. A method for processing an earphone pressure relief hole by laser, comprising the following steps:
[0023] S1: product preparation, obtaining the earphone shell 10 with the pressure relief hole 12 to be processed. like figure 2 As shown, it is the earphone shell 10 that needs to be made with the pressure relief hole 12 provided by the present invention. The earphone housing 10 is a hollow structure, and has a processed surface 11 on which the pressur...
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Abstract
The invention provides a method for processing a pressure relief hole of an earphone by using laser. The method comprises the following steps of preparation of a product: obtaining an earphone shell of which a pressure relief hole is to be processed; software design: drawing the hole diameter and the punching mode of the pressure relief hole through drawing software, making up a processing file and conveying the processing file into a laser engraving machine; and hole site processing: conducting at least one time of laser engraving on the earphone shell in a punching mode set on the processing file by a laser engraving machine, wherein the laser engraving machine adopts an ultraviolet nanosecond laser device, an optical focus lens and a high-speed scanning galvanometer. The hole diameter of the pressure relief hole formed by the method for processing the pressure relief hole of the earphone by using the laser can be as accurate as 0.05 mm, and the pressure relief hole formed by adopting the ultraviolet nanosecond laser with the wavelength of 355 nm is good in processing performance stability, high in cost performance, small in processing heat influence and high in reliability. The processing method provided by the invention is simpler, quicker, low in cost, low in energy consumption, free of pollution and high in precision.
Description
technical field [0001] The invention relates to the technical field of laser processing, in particular to a method for processing a pressure relief hole of an earphone by using a laser. Background technique [0002] Along with the continuous development of modern science and technology level, earphone is a kind of audio-visual equipment commonly used as people's daily wear. In order to provide better sound effects for the earphones, the current earphones generally have pressure relief acoustic holes to improve the sound effect of the earphones. The function of the pressure relief hole set on the earphone is to release the air pressure in the enclosed space of the earphone, so that the diaphragm has a larger amplitude and increases a certain sense of bass. Because the air pressure in the closed space will give a certain reaction force to the diaphragm, so that its amplitude is limited, and the sense of volume of the bass will be reduced in hearing. After the pressure relief...
Claims
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IPC IPC(8): B23K26/382
CPCB23K26/382
Inventor 龙明昇吕启涛廖文高云峰
Owner HANS LASER TECH IND GRP CO LTD