RGBLED packaging substrate for display
A technology for packaging substrates and displays, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as raising the maintenance cost of LED display screens, increasing maintenance workload and difficulty, affecting product air tightness, etc. Metal migration risk, delamination risk reduction, area reduction effect
Pending Publication Date: 2021-11-26
广东韶华科技有限公司
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Problems solved by technology
At the same time, after electroplating nickel / silver / gold, the adhesion between the metal base island and the epoxy resin will be reduced, which will easily cause delamination and affect the airtightness of the product
[0003] Under the action of humidity, temperature and electric field, LEDs are prone to metal ionization migration between chip electrodes, chip (side) and upper core metal base island, and substrate metal wires, resulting in defects such as dead lights, dark lights, and string lights. Increased maintenance workload and maintenance difficulty, these factors have raised the maintenance cost of LED display
Method used
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Embodiment
[0033] In this embodiment, a RGB LED packaging substrate for display includes a substrate 1, and the substrate 1 is a double-sided copper-clad BT board; after mechanical or laser drilling on the substrate 1, electroless copper plating and electroplating copper are performed, and the holes are A copper layer is formed around the wall to form a via hole 7 to realize the electrical connection of the front and back circuits; then, the base island and the substrate circuit are fabricated by masking, exposure, development and chemical etching. The core base island 2 on the R chip is used to fix the R chip; the core base island 3 on the GB chip is used to fix the GB chip and is separated from the core base island 2 on the R chip. It is always uncharged, and the potential difference between the lines is reduced. risk of metal migration. The core base island 3 on the GB chip is not electroplated, which reduces the nickel / silver / gold plating area, increases the adhesion between the meta...
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The invention discloses an RGB LED packaging substrate for display, which comprises a substrate, an R chip upper core base island for fixing an R chip and a GB chip upper core base island for fixing a GB chip are arranged on the front surface of the substrate, and the R chip upper core base island and the GB chip upper core base island are not in contact with each other; a bonding wire base island is also arranged on the front surface of the substrate and is used for bonding the LED chip and the substrate by a bonding wire to realize electric communication; the front surface of the substrate is provided with a via hole penetrating to the back surface, and the via hole is used for realizing electric connection between the front surface and the back surface. A bonding pad is arranged on the back surface of the substrate and is used for realizing electrical communication between the LED equipment and the SMTPCB; and the back surface of the substrate is also provided with an electroplating connecting wire. The invention has the advantages of high air tightness, good heat dissipation, high reliability and high contrast ratio.
Description
technical field [0001] The invention belongs to the field of semiconductor packaging, in particular to an RGB LED packaging substrate for display. Background technique [0002] As the size of LED packaging devices becomes smaller and smaller, the airtightness and heat dissipation capabilities of products need to be improved urgently. Most LED packaging substrate coatings are processed by electroplating, and the substrate units are connected by metal wires. After cutting and separation, the metal wires are exposed on the side of the product, forming a moisture absorption channel for the product. At the same time, after electroplating nickel / silver / gold, the adhesion between the metal base island and the epoxy resin is reduced, which is easy to cause delamination and affects the airtightness of the product. [0003] Under the action of humidity, temperature and electric field, LEDs are prone to metal ionization migration between chip electrodes, chip (side) and upper core met...
Claims
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Login to View More IPC IPC(8): H01L23/495H01L23/544H01L25/075
Inventor 颉信忠周永寿刘天生孙彦龙
Owner 广东韶华科技有限公司