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Thermally conductive composite tape

A technology of thermal conductivity and composites, applied in the direction of film/sheet adhesives, adhesives, pressure-sensitive films/sheets, etc., can solve the problems of poor heat transfer of thermally conductive sheets, and achieve good bonding strength and insulation good effect

Pending Publication Date: 2021-11-26
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, there is a method of coating an adhesive on both sides of a thermally conductive sheet to produce a thermally conductive sheet with an adhesive, but since the adhesive itself has no thermal conductivity, the heat transfer of the thermally conductive sheet with an adhesive significantly deteriorates. Difference

Method used

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  • Thermally conductive composite tape
  • Thermally conductive composite tape
  • Thermally conductive composite tape

Examples

Experimental program
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Effect test

Embodiment

[0103] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated in more detail, this invention is not limited to a following example.

[0104] The reinforcement layer (A) used in the following examples and comparative examples, and (a) component - (f) component which comprise a 1st thermally conductive adhesive layer and a 2nd thermally conductive adhesive layer (B) are as follows.

[0105] [enhancement layer (A)]

[0106] (X) Glass cloth: gray cloth H28F103 made by Unitika, 30μm, 28g / m 2

[0107] (Y) Polyimide: 30EN 7.5 μm made by Kapton

[0108] [Thermally conductive adhesive layer (B)]

[0109] (a) Component: dimethyl polysiloxane raw rubber having an average degree of polymerization of 8000 and having dimethyl vinyl groups at both terminals

[0110] (b) Ingredients:

[0111] (b-1) Granular alumina having a volume average particle diameter of 1 μm

[0112] (b-2) Spherical alumina having a volume average particle diameter ...

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Abstract

The purpose of the present invention is to provide a thermally conductive composite tape which is easily handleable by being in the form of a sheet, while having excellent strength and insulation properties, and which is able to easily fix itself to an element or a heat dissipation member, while exhibiting excellent bonding strength to the heat dissipation member. [Solution] A thermally conductive composite body which comprises a first thermally conductive bonding layer, a reinforcement layer (A) that is superposed on one surface of the first thermally conductive bonding layer, and a second thermally conductive bonding layer that is superposed on the reverse side surface of the reinforcement layer (A) from the above-mentioned one surface, and which is characterized in that the first and second thermally conductive bonding layers are independently composed of silicone compositions that contain the components (a)-(e) described below. (a) 100 parts by mass of a linear or branched organopolysiloxane (b) 1,000-3,000 parts by mass of a thermally conductive filler (c) 100-500 parts by mass of a silicone resin (d) 1-10 parts by mass of an organohydrogen polysiloxane (e) 0.5-5 parts by mass of an organic peroxide.

Description

technical field [0001] The present invention relates to a thermally conductive cured product which can be inserted and mounted between a thermal boundary surface of a heat-generating element and a heat-radiating member such as a heat sink or a circuit board for cooling the heat-generating element, and a method for producing the same . Background technique [0002] Semiconductors such as transistors and diodes used in electronic equipment such as converters and power supplies, and semiconductors such as Light Emitting Diode (LED) elements used as light sources for lighting or displays are accompanied by high performance, high speed, small size, high Integration itself generates a large amount of heat, and the temperature rise of the device due to the heat can cause malfunction and damage. Therefore, a large number of heat radiation methods for suppressing temperature rise of a semiconductor during operation and heat radiation members used in these methods have been proposed....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/00C09J7/38
CPCC08K3/22C08K3/08C08K3/28C09J2483/00C09J7/30C09J2301/124C09J2301/408C08K2201/001C09J2427/006C09J2467/006C09J2479/086C09J2203/326C09J2400/263C09J2400/143C09J183/04C08G77/12C08G77/20C08G77/16C08K5/14C08L83/00C09J7/38C09J183/00C08K5/541C08L83/04
Inventor 伊藤崇则远藤晃洋
Owner SHIN ETSU CHEM IND CO LTD