Efficient fluoride-free etching solution for copper-molybdenum alloy film

Abstract

The invention belongs to the technical field of metal etching, and particularly relates to an efficient fluoride-free etching solution for a copper-molybdenum alloy film. The etching solution is prepared from the following components in percentages by mass: 1-5wt% of peroxide, 5-10wt% of organic acid, 0.1-1wt% of a corrosion inhibitor, 1-5wt% of a chelating agent and the balance of deionized water. According to the etching solution, etching can be efficient and safe, toxic and side effects of fluorine are avoided, CD loss can be kept at 1 + / - 0.2 [mu] m, the etching slope angle is stabilized between 45 degrees and 55 degrees, the service life of the etching solution is long, and the etching requirements of customers on copper-molybdenum alloy can be better met.

Description

technical field [0001] The invention relates to the technical field of metal etching, in particular to an etching solution for high-efficiency fluorine-free copper-molybdenum alloy film. Background technique [0002] In the current high-generation liquid crystal panel production process, the size of the panel is enlarged, and copper alloy is used for the grid and metal wiring. Compared with the previous aluminum alloy, the resistance is lower and there is no environmental problem. However, copper has low adhesion to glass substrates and insulating films, so molybdenum is usually used as the lower film metal, so the film structure is actually a copper / molybdenum alloy. In the process of etching copper-molybdenum alloys, although molybdenum is more difficult to etch than copper, molybdenum only plays the role of connecting copper and glass substrates, and the thickness is generally less than 1 / 10 of the thickness of copper, so generally molybdenum can always be etched away fir...

AI Technical Summary

Problems solved by technology

Etching solution usually adopts two methods of adding fluoride or greatly increasing the content of hydrogen peroxide, but these two methods have the following disadvantages: 1. The ionization of fluoride to produce fluorine ions will cause great environmental pollution, and the cost of etching waste liquid treatment is high; 2. Fluorine Ion toxicity is high, and the operator's operation risk is high; 3. Fluoride ions are highly corrosive and will etch glass substrates

When the content of hydrogen peroxide is high, during the etching process, as the content of metal ions increases, the hydrogen peroxide is rapidly decomposed and a large amount of heat is released, resulting in uneven etching, and at the same time may cause an explosion, resulting in casualties and property losses of the company

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