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Manufacturing process of power battery pack signal acquisition circuit board

A power battery pack and signal acquisition technology, which is applied in the fields of printed circuit manufacturing, printed circuit, insulating substrate/layer processing, etc., can solve the problems of dangerous operation, high cost, complex process wastewater, etc., and achieve easy film tearing, high Peel force and shear force, the effect of simple process

Pending Publication Date: 2021-12-10
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, integrated circuits in the market are mainly produced by hot pressing and etching, but the cost and unit beat of hot pressing are too high to meet the market demand; the production of etching is complicated and the process will generate a lot of waste water, which affects environmental protection.
[0004] CN102480843A discloses a circuit board and a manufacturing method thereof, comprising the following process steps of preparing a base material; placing a flexible base material with a metal foil on the surface and bonding it to the base material; preparing a die, Die-cutting downwards through the surface of the flexible base material with metal foil by using a knife die, the tangent runs through the flexible base material with metal foil and forms the required circuit; peeling off the metal foil and flexible base material other than the required circuit; pressing with After the flexible substrate of the metal foil and the substrate, the required circuit board is formed, thereby solving the problem that the conventional method in the prior art needs to be treated by chemical corrosion solvents during the production process, which is easy to cause environmental pollution and operational hazards, and due to production Technical problems such as complicated and expensive equipment and high cost of raw materials
In addition, the heating and pressing method is used in the bonding process, which is slow in efficiency and high in cost.

Method used

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  • Manufacturing process of power battery pack signal acquisition circuit board
  • Manufacturing process of power battery pack signal acquisition circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] The manufacturing process of the power battery pack signal acquisition circuit board in this embodiment includes the following steps:

[0059] 1) Paste the silicone film on the aluminum foil for line positioning;

[0060] 2) On the aluminum foil after the circuit positioning obtained in step 1), carry out circuit die-cutting by half-cutting with a hob, and form a wire pattern on the aluminum foil, wherein the aluminum foil is cut and the organic silica gel film is not cut during die-cutting;

[0061] 3) The aluminum foil after the line die-cutting in step 2) is removed to expose the organic silica gel film to obtain an aluminum foil with a conductive pattern attached to the organic silica gel film;

[0062] 4) Paste one side of the aluminum foil after step 3) after removing the remaining material to the single-sided cured adhesive film; the single-sided cured adhesive film includes interconnected PET film layers and cured adhesive layers; the cured adhesive for the cure...

Embodiment 2

[0067] The manufacturing process of the power battery pack signal acquisition circuit board in this embodiment includes the following steps:

[0068] 1) Paste the silicone film on the aluminum foil for line positioning;

[0069] 2) Carry out circuit die-cutting on the aluminum foil after the circuit positioning obtained in step 1) to form a wire pattern on the aluminum foil, wherein the aluminum foil is cut off and the silicone film is not cut off during die-cutting;

[0070] 3) The aluminum foil after the line die-cutting in step 2) is removed to expose the organic silica gel film to obtain an aluminum foil with a conductive pattern attached to the organic silica gel film;

[0071] 4) Paste one side of the aluminum foil after step 3) after removing the remaining material to the single-sided cured adhesive film; the single-sided cured adhesive film includes interconnected PET film layers and cured adhesive layers; the cured adhesive for the cured adhesive layer is produced by ...

Embodiment 3

[0076] The manufacturing process of the power battery pack signal acquisition circuit board in this embodiment includes the following steps:

[0077] 1) Paste the silicone film on the aluminum foil for line positioning;

[0078] 2) On the aluminum foil after the circuit positioning obtained in step 1), carry out circuit die-cutting by half-cutting with a hob, and form a wire pattern on the aluminum foil, wherein the aluminum foil is cut and the organic silica gel film is not cut during die-cutting;

[0079] 3) The aluminum foil after the line die-cutting in step 2) is removed to expose the organic silica gel film to obtain an aluminum foil with a conductive pattern attached to the organic silica gel film;

[0080] 4) Paste one side of the aluminum foil after step 3) after removing the remaining material to the single-sided cured adhesive film; the single-sided cured adhesive film includes interconnected PET film layers and cured adhesive layers; the cured adhesive for the cure...

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Abstract

The invention discloses a manufacturing process of a power battery pack signal acquisition circuit board. The manufacturing process comprises the following steps of: 1) pasting an organic silica gel film on a metal foil to performline positioning; 2) performing line die cutting on the metal foil subjected to line positioning, and forming a wire pattern on the metal foil; 3) removing a metal foil waste material after line die cutting to expose the organic silica gel film, and obtaining the metal foil which has the wire pattern and pasted with the organic silica gel film; 4) transferring and pasting one side of the metal foil subjected to waste removal to a glue-containing insulating material; (5) removing the organic silica gel film, andattaching the other face of the metal foil to another glue-containing insulating material; (6) shaping an obtained product; and 7) performing low-temperature curing on the shaped product to obtain the power battery pack signal acquisition circuit board. According to the manufacturing process, a cold film pasting mode is adopted, the technological process is simple and more efficient, and a manufactured assembly can meet the design requirements of customers.

Description

technical field [0001] The invention relates to the field of processing of power battery upper cover components, in particular to a manufacturing process of a power battery pack signal acquisition circuit board. Background technique [0002] At present, the development trend of miniaturization and high speed of electronic products is pushing the electronic circuit board industry into a new period of development. Multiple steps such as exposure, development, and etching form conductive lines, and then form circuit boards. [0003] At present, integrated circuits in the market are mainly produced by hot pressing and etching, but the cost and unit beat of hot pressing are too high to meet the market demand; the production of etching is complicated and the process will generate a lot of waste water, which affects environmental protection. . [0004] CN102480843A discloses a circuit board and a manufacturing method thereof, comprising the following process steps of preparing a ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/00H05K3/0055H05K3/0011
Inventor 张英泉李晓旭王少星陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC