Extended range vacuum measurement chip and its forming method
A technology for vacuum measurement and expansion, which is used in liquid/vacuum measurement for liquid tightness, vacuum gauges, measuring devices, etc., and can solve the problems of process control lag, small dynamic range, and limited measurement range.
Active Publication Date: 2022-03-22
矽翔微机电系统(上海)有限公司
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[0004] The purpose of the present invention is to provide an extended-range vacuum measurement chip and its forming method, so as to alleviate the limitation of the measurement range caused by the small dynamic range, low precision and gas composition dependence of the existing vacuum measurement technology. In vacuum applications such as deposition or semiconductor integrated circuit manufacturing, multiple vacuum sensors are required to be used together to meet the requirements, resulting in more complicated control process and technical problems of process control lag
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[0048] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0049] Such as figure 1 and Figure 11 As shown, the embodiment of the present invention provides an extended range vacuum measurement chip, which specifically includes:
[0050] Substrate 100, the substrate 100 includes a heat-insulating cavity 110; the material of the substrate 100 is preferably but not limited to silicon, wherein part of the silicon material can be removed from the back of the substrate 100 by standard MEMS plasma ion deep etching to form the above-mentioned thermal-insulating cavity 110. The therm...
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Abstract
The invention provides an extended-range vacuum measurement chip and a forming method thereof, relating to the technical field of vacuum measurement, comprising: a base body, the base body includes a heat insulation cavity; a first heat insulation layer covering the first surface of the base body, and located in the heat insulation cavity above; the first heat-sensitive sensor, the second heat-sensitive sensor and the thermal radiation sensor arranged on the first heat insulation layer; The side of the radiation sensor away from the second thermal sensor. Using the principle of thermal time-of-flight, through the first thermal sensor, the second thermal sensor, the thermal radiation sensor and the thermopile sensor, the extended vacuum range from positive pressure to vacuum to high vacuum is measured according to the thermal properties of the gas. The chip is suitable for All extended range vacuum measurements, at the same time, the chip is not affected by changes in gas composition, maintains its reliability when the vacuum changes rapidly, and can be used for vacuum leak detection.
Description
technical field [0001] The invention relates to the technical field of vacuum measurement, in particular to an extended range vacuum measurement chip and a forming method thereof. Background technique [0002] Vacuum sensors are widely used in high-end manufacturing, especially in the semiconductor industry. Some current vacuum measurement technologies have problems such as small dynamic range, low precision, and dependence on gas composition. Therefore, for high vacuum applications, several vacuum sensors with different measuring principles must be used to meet the requirements. For example, at atmospheric pressure to 10 -3 In the low vacuum range of Torr, Pirani or capacitance vacuum gauge occupies a large proportion, and its structure is simple, but it is very easy to damage. Higher vacuums or lower pressures often use ion vacuum gauges. However, the ion meter requires high voltage and high cost. In addition, Pirani vacuum gauges are related to gaseous media, because...
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IPC IPC(8): G01L21/00G01M3/02H01L27/16H10N19/00
CPCG01L21/00G01M3/02H10N19/00
Inventor 黄立基
Owner 矽翔微机电系统(上海)有限公司