Conveying system for semiconductor packaging production line

Abstract

The invention relates to the technical field of semiconductor packaging production, and discloses a conveying system for a semiconductor packaging production line. The system comprises a control unit and a driving unit electrically connected with the control unit, one end of the driving unit is mounted at one side of a primary conveying unit, and the other end of the driving unit is mounted on one side of a cutting unit. A clamping unit is arranged at the upper end of the primary conveying unit, a secondary conveying unit is arranged at the tail end of the cutting unit, and the secondary conveying unit is electrically connected with the control unit, so that fixed-length output can be achieved, conveying and cutting of a semiconductor winding tape are facilitated, the semiconductor winding tape can be stably conveyed forwards, the conveying stability of the semiconductor winding tape is improved, the same driving gear is ingeniously utilized, the semiconductor winding tape can be conveyed and cut, along with continuous rotation of the driving gear, the semiconductor winding tape can be continuously conveyed and cut, the structural arrangement is ingenious, the working efficiency is guaranteed, meanwhile, use of electrical equipment is reduced, and programming control of a control unit is also simple.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging production, in particular to a conveying system used in a semiconductor packaging production line. Background technique [0002] Semiconductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. The packaging process is: the wafer from the wafer front-end process is cut into small chips after the dicing process, and then the cut chips are glued to the small island of the corresponding substrate (lead frame) frame, and then Use ultra-fine metal (gold-tin-copper-aluminum) wires or conductive resin to connect the bonding pads of the chip to the corresponding pins of the substrate to form the required circuit; then the independent chip is packaged and protected with a plastic case, After plastic sealing, a series of operations need to be carried out. After the packaging is completed, th...

AI Technical Summary

Problems solved by technology

[0003] However, when the conveying system used in today's semiconductor packaging production line transports semiconductors, the conveying and slicing of semiconductor tapes are separate use of corresponding equipment, and there is no clever use of the drive of the conveying system to cooperate with slicing. The structure is complicated. Corresponding use of electrical equipment is required, and the cost of use is high. In order to match the efficienc

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