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Dry cleaning apparatus using plasma and steam

A technology for plasma and cleaning equipment, applied in the direction of cleaning method using liquid, plasma, cleaning method using gas flow, etc., can solve problems such as substrate pollution sources, reduce maintenance costs, improve productivity and hardware stability, processing The effect of shortening time

Pending Publication Date: 2021-12-17
艾斯宜株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0018] The present invention also relates to providing a dry cleaning apparatus using plasma and steam, wherein the solution to the problem of removing ammonium hexafluorosilicate ((NH 4 ) 2 SiF 6 ) during the process of reaction by-products adhere to the inner wall of the chamber and become a contamination source of the substrate

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  • Dry cleaning apparatus using plasma and steam
  • Dry cleaning apparatus using plasma and steam
  • Dry cleaning apparatus using plasma and steam

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Embodiment Construction

[0043] The specific structural and functional descriptions of the embodiments of the present invention disclosed in this specification are only for the purpose of describing the embodiments of the present invention, and the embodiments of the present invention can be embodied in various forms and are not construed as being limited to those described in this specification. the embodiment.

[0044] While the embodiments of the invention may be modified in various ways and take various alternative forms, specific embodiments thereof are shown in the drawings and described in detail in this specification. It is not intended that the invention be limited to the particular forms disclosed. On the contrary, the invention is intended to cover modifications, equivalents, and alternatives falling within the spirit and scope of the appended claims.

[0045] It should be understood that although the terms "first" and "second", etc. may be used herein to describe various elements, these e...

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PUM

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Abstract

A dry cleaning apparatus using plasma and steam, according to the present invention, comprises: a chamber having an upper supply port formed on an upper surface part thereof, having a discharge port formed on a lower surface part thereof, having a side supply port formed on a side surface part thereof, and providing a cleaning space; a chuck which is coupled to the lower surface part of the chamber, and on which a monocrystalline silicon substrate including amorphous silicon, polycrystalline silicon, silicon oxide, or silicon nitride is arranged; an RF electrode which is coupled to the upper surface part of the chamber, and to which RF power is applied; an upper shower head which is coupled to the RF electrode so as to communicate with the upper supply port formed on the upper surface part of the chamber, and which has a plurality of upper spray holes formed thereon; a lower shower head, which is coupled to the side surface part of the chamber, has a plurality of first lower spray holes, has a plurality of second lower spray holes that allow communicating with the side supply port, formed thereon and are electrically grounded; a reaction gas supply unit for supplying reaction gas through the upper supply port formed on the upper surface part of the chamber; and a stem supply unit for supplying hot steam through the side supply port formed on the side surface part of the chamber.

Description

technical field [0001] The present invention relates to a dry cleaning device using plasma and steam, and more particularly, to a dry cleaning device using plasma and steam that uses high temperature Ammonium hexafluorosilicate ((NH 4 ) 2 SiF 6 ) is evaporated and removed, which significantly shortens the processing time, solves the problem of reaction by-products adhering to the inner wall of the chamber and becoming a pollution source of the substrate during the process of removing reactants, increases the cleaning cycle of the chamber itself, and stably An in-situ process in which reactants are repeatedly generated in one chamber and evaporated and removed using high-temperature steam is implemented, and productivity and hardware stability are improved. Background technique [0002] Among the dry cleaning methods, the plasma dry cleaning method is a method in which reactants are activated using plasma so that cleaning is performed using a chemical or physical reaction ...

Claims

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Application Information

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IPC IPC(8): B08B3/02B08B5/02B08B7/00B08B13/00
CPCB08B3/02B08B5/02B08B7/00B08B13/00H05H1/46H01L21/3065H01L21/67H01J37/32H01L21/02H01L21/67034H01L21/67098H01L21/67248H01J37/32009H01L21/02046
Inventor 李佶洸林斗镐吴相龙朴在阳
Owner 艾斯宜株式会社