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Preparation method of special diamond cutting fluid for silicon carbide

A technology of diamond cutting and configuration methods, which is applied in the petroleum industry, lubricating compositions, etc., can solve problems such as difficult cleaning, high viscosity of oily mortar, strong adhesion, etc., and achieve good effect, low cost, and good suspension.

Pending Publication Date: 2021-12-24
安徽微芯长江半导体材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, oily mortar has high viscosity and strong adhesion, so it is not easy to clean, so it needs to be cleaned with kerosene

Method used

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  • Preparation method of special diamond cutting fluid for silicon carbide
  • Preparation method of special diamond cutting fluid for silicon carbide
  • Preparation method of special diamond cutting fluid for silicon carbide

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] A method for configuring a special diamond cutting fluid for silicon carbide, the production steps are as follows:

[0027] (1) Take the required amount of glycol and pour it into the mixing tank;

[0028] (2) Measure the required amount of polyglycol in proportion and pour it into the mixing tank;

[0029] (3) Turn on the mixing function of the mixing tank;

[0030] (4) Weigh the required amount of dispersant, and slowly pour it into the mixing tank ...

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Abstract

The invention discloses a preparation method of special diamond cutting fluid for silicon carbide. Oily mortar conventionally used for cutting silicon carbide crystals is replaced with hydrophilic mortar, and a dispersing agent in a certain proportion is added to ensure that the mortar has a good dispersion effect, so that the cleaning effect of a cut wafer can be improved on the premise of not influencing the cutting effect of the mortar. The mortar does not need to be cleaned by flammable and explosive organic solvents such as kerosene and the like, can be easily cleaned by clean water or low-concentration alkali liquor, can effectively reduce the environmental assessment grade, and is quite suitable for batch production of silicon carbide substrates.

Description

technical field [0001] The invention relates to a preparation method of special diamond cutting fluid for silicon carbide. Background technique [0002] As a representative of the third-generation semiconductor, silicon carbide has the characteristics of large band gap, high breakdown electric field, high saturation electron drift velocity, and high thermal conductivity. It can be applied to high-voltage environments above 1200 volts, so it can At the same time, SiC crystal is an ideal substrate material for GaN-based devices, such as LEDs and LDs, because of its highly matched lattice constant and thermal expansion coefficient and good thermal conductivity with the epitaxial layer material GaN. Therefore, SiC crystal material has become an indispensable substrate material in the field of semiconductor lighting technology. At present, silicon carbide and silicon carbide-based semiconductor materials have become a research hotspot around the world. [0003] Applying silicon...

Claims

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Application Information

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IPC IPC(8): C10M177/00C10M169/04C10N30/04
CPCC10M177/00C10M169/044C10M2207/022C10M2207/0225C10M2209/105C10M2217/024C10M2201/041C10N2030/04
Inventor 陈辉王升李有群贺贤汉
Owner 安徽微芯长江半导体材料有限公司