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Method for accurately representing thermomechanical material parameters of multilayer circuit board

A multi-layer circuit board and multi-layer circuit technology, which is applied in CAD circuit design, special data processing applications, design optimization/simulation, etc. problems, to achieve the effect of high accuracy of results, low cost, and elimination of interference from microscopic factors

Pending Publication Date: 2021-12-24
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Claims
  • Application Information

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Problems solved by technology

However, on the one hand, this kind of microscopic characterization technology is expensive, on the other hand, because the material parameters in the microscopic area are often scattered, they are easily affected by test conditions and sample quality, and may also lead to deviations from the actual macroscopic physical parameters.

Method used

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  • Method for accurately representing thermomechanical material parameters of multilayer circuit board
  • Method for accurately representing thermomechanical material parameters of multilayer circuit board
  • Method for accurately representing thermomechanical material parameters of multilayer circuit board

Examples

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Embodiment 1

[0036] In the present invention, taking samples assembled with printed circuit boards and chips as an example, the following technical solutions are used to characterize the thermal physical parameters of fine materials of multilayer printed circuit boards:

[0037] (1) Experimental sample preparation. Assemble the studied printed circuit board with the chip, such as figure 2 (a), or prepared into simple binary or ternary structures, such as figure 2 (b).

[0038] (2) Section sample preparation. Higher quality sections are made by cutting, grinding, polishing, etc., such as figure 2 (c), and spray-paint black and white spots on the section.

[0039] (3) Experimental characterization. The sample is heated, and the displacement distribution of the section is analyzed by two-dimensional digital correlation analysis, such as image 3 (a) and 3(c).

[0040] (4) Simulation modeling. According to the actual experimental sample structure, the simulation model is constructed...

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Abstract

The invention discloses a method for accurately representing thermomechanical material parameters of a multilayer circuit board, and belongs to the technical field of thermomechanical material parameters. The method comprises the following steps: (1) preparing a multilayer circuit board with a simple binary or ternary structure; (2) preparing a high-quality cross section, and spraying black and white spots on the cross section to obtain a sample; (3) heating the sample, and obtaining the displacement distribution A of the cross section through characterization; (4) constructing a model in simulation model software according to the structure and the actual size of the sample; (5) inputting thermophysical parameters of the thermomechanical material, setting the same heating temperature, and performing finite element simulation calculation to obtain displacement distribution B of the cross section; and (6) comparing the displacement distribution B with the displacement distribution A, and obtaining thermophysical parameters of the thermomechanical material of the multilayer circuit board through backstepping. The method of comparing the experiment with the simulation displacement is adopted, the detailed thermal mechanical physical property parameters of the printed circuit board are obtained in a backstepping mode, the result accuracy is high, and the data accuracy is verified in the data obtaining process.

Description

technical field [0001] The invention belongs to the technical field of material parameter characterization, in particular to a method for accurately characterizing the thermomechanical material parameters of a multilayer circuit board. Background technique [0002] With the needs of national economic growth and the rapid development of information technology, electronic products continue to develop in the direction of miniaturization, light weight, high performance, multi-function, low cost, etc., and almost all electronic products need the support of printed circuit boards . The common English abbreviation of printed circuit board is PCB (Printed circuitboard) or PWB (Printed wireboard), which is the support body of chips and electronic components. The printed circuit board contains metal conductors as the lines connecting electronic components, and dielectric materials are placed between the metal conductors to achieve insulation and avoid signal crosstalk. In addition, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/23G06F30/39
CPCG06F30/23G06F30/39
Inventor 钟诚鲁济豹李呈龙彭韬李刚朱朋莉孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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