Full-automatic silicon wafer surface efficient scrubbing and cleaning device and operation method

Abstract

The invention relates to a full-automatic silicon wafer surface efficient brushing and cleaning device and an operation method. The full-automatic silicon wafer surface efficient brushing and cleaning device comprises a shell, a cavity is formed in the shell, a supporting mechanism used for containing a silicon wafer for cleaning is arranged in the middle of the cavity, water storage tanks are fixedly mounted on the upper side and the lower side of the supporting mechanism, a guide plate is arranged on one side of the supporting mechanism, a recycling mechanism is arranged below the guide plate, and a cooling mechanism used for cooling the silicon wafer is arranged at the position, on one side of the recycling mechanism, on the inner wall of the shell. An incomplete gear is driven to rotate through running of a second rotating shaft, so that a moving plate slides in a reciprocating limiting manner in a second sliding groove, a spray head rotates under the action of a fixing pin, cold air is uniformly sprayed to the dried silicon wafer through swinging of the air spraying end of the spray head, and therefore the cooling speed of the silicon wafer is increased, and meanwhile cold air is uniformly sprayed, so that the probability of damage caused by uneven heating of the silicon wafer is reduced.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cleaning, in particular to a fully automatic silicon wafer surface high-efficiency brush cleaning device and an operation method. Background technique [0002] After the silicon wafer is cut, it needs to be degummed and cleaned; the silicon wafer is dried by hot air after being cleaned in the washing machine; at present, the temperature of the silicon wafer dried by the silicon wafer washing machine is 60-70 degrees Celsius. Affect the detection accuracy of the sorter for silicon wafers. [0003] The traditional solution is to place the silicon wafers for a period of time until the temperature of the silicon wafers drops to about 30 degrees Celsius, and then go to the sorting machine for sorting; this will prolong the processing time and affect the production efficiency. Blowing cold air on the wafer cannot effectively cool down the silicon wafer. At the same time, the traditional silicon w...

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Problems solved by technology

[0002] After the silicon wafer is cut, it needs to be degummed and cleaned; the silicon wafer is dried by hot air after being cleaned in the washing machine; at present, the temperature of the silicon wafer dried by the silicon wafer washing machine is 60-70 degrees Celsius. Affect the detection accuracy of the sorter for silicon wafers

[0003] The traditional solution is to place the silicon wafers for a period of time until the temperature of the silicon wafers drops to about 30 degrees Celsius, and then go to the sorting machine for sorting; this will prolong the processing time and affect the production efficiency. Blowing cold air on the wafer cannot effectively cool down the silicon wafer. At the same time, the traditional silicon wafer cleaning method cannot effectively clean both sides of the silicon wafer at the same time, resulting in a low cleaning efficiency of the silicon wafer.

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