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Shaving board cooling and humidifying dual-treatment structure, machining device with shaving board cooling and humidifying dual-treatment structure and shaving board cooling and humidifying dual-treatment method

A particleboard, double-processing technology, applied in the field of particleboard processing, can solve the problems of inability to cool and adjust the humidity of multiple particleboards, and achieve the effect of enhancing the effect of humidity adjustment

Active Publication Date: 2022-01-07
江苏瑞泰人造板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] One of the purposes of the present invention is to solve the problem that in the prior art, a plurality of particle boards cannot be simultaneously cooled and adjusted for humidity

Method used

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  • Shaving board cooling and humidifying dual-treatment structure, machining device with shaving board cooling and humidifying dual-treatment structure and shaving board cooling and humidifying dual-treatment method
  • Shaving board cooling and humidifying dual-treatment structure, machining device with shaving board cooling and humidifying dual-treatment structure and shaving board cooling and humidifying dual-treatment method
  • Shaving board cooling and humidifying dual-treatment structure, machining device with shaving board cooling and humidifying dual-treatment structure and shaving board cooling and humidifying dual-treatment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] Particleboard one kind of cooling, the humidity dual processing architecture, such as Figure 1-4 Shown, wherein the processing component 10 includes an upper and a lower handle assembly 20.

[0074] like Figure 4 , The upper handle assembly 10 with the lifting drive coupling structure, the processing assembly 10 is moved up and down by the elevating drive configuration, the processing component 10 has a rod 11 on the reactor.

[0075] like Figure 5 , 6 , The lower handle assembly 20 is disposed below the upper handle assembly 10, the handle assembly 20 includes: a reaction rod 21, the ball 22 the reaction, water rods 23, lagging 24, the slider 25.

[0076] The reaction is reacted with the lever 21 between the stem 11 having a void, the void size is larger than the thickness of the particleboard.

[0077] The reaction activities of the ball 22 is embedded in the lower reaction rods 21, the reaction with the vapor space within the ball 22, the ball 22 on the side of the react...

Embodiment 2

[0094] Processing device, such as figure 1 , 2 As shown in, the processing device includes a particle plate cooling in one of the above-described disciplines, a humidification double treatment structure, a particle plate cooling, and a humidification double treatment structure mounted in the processing space 31 of the box 30.

[0095] After the hot pressing particle plate is placed in the lower treatment assembly 20, the processing space 31 is sealed, and then the particle plate is processed by the upper processing assembly 10, so that the water vapor discharged from the reactive ball 22 can be filled with the entire sealed treatment space 31. , Enhance the humidification effect, and achieve a humidification process for multiple particles.

[0096] like image 3 , 4 As shown, the lifting structure coupled to the upper processing assembly 10 is a drive mechanism, and the drive mechanism is connected to the left wire 41 and the right screw 42, the left screw 41, and the right screw 4...

Embodiment 3

[0100] A processing apparatus having a particle plate cooling, a humidification double treatment structure as an example, a modulus of a structure, such as Image 6 As shown, the restricted plate 241 is rotated mounted on the sleeve 24, and the resilial binder of the restricted plate 241 is brought into the recess of the reaction ball 22, and the pressure spring is mounted between the recess wall surface of the reaction ball 22.

[0101] The challenge head 242 is slidably connected to the annular groove of the reaction ball 22, and the pick head 242 has a function of sliding along the annular groove.

[0102] Through the above structure, the reaction ball 22 can be rotated.

[0103] like Figure 10 As shown, the drive motor 70 is mounted on the side wall of the processing space 31, and the drive motor 70 is connected to the swing lever 71, and the swing rod 71 is mounted, and the rotary electric machine 80 is connected to the rotating shaft 81, and the shaft 81 is connected to the d...

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PUM

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Abstract

The invention discloses a shaving board cooling and humidifying dual-treatment structure, and relates to the technical field of shaving board machining. The shaving board cooling and humidifying dual-treatment structure comprises an upper treatment assembly and a lower treatment assembly, and the lower treatment assembly is provided with lower reaction rods, reaction balls, water passing rods, sleeve plates and sliding plates. The water passing rods penetrate into the reaction balls, and steam openings of the reaction balls are temporarily sealed through the sliding plates, so that on one hand, when hot-pressed shaving boards are placed on the reaction balls, water steam generated by the reaction balls can be temporarily reserved in the reaction balls, and the shaving boards are released after being placed into the lower treatment assembly layer by layer; and on the other hand, after the reaction balls generate water steam, water passing channels of the water passing rods are sealed, so that water cannot flow into the reaction balls, it is guaranteed that only water in the reaction balls can generate the water steam, the content of the generated water steam is increased, then the shaving boards are pressed downwards on the upper treatment assembly (the shaving boards are pressed, and the warping phenomenon can be avoided), the reaction balls are promoted to move, and when the steam openings are opened, the humidifying effect on the shaving boards can be improved.

Description

Technical field [0001] The present invention relates to particle board processing technology, and more particularly, to a particleboard cooling, the humidity dual processing architecture. Background technique [0002] Particleboard slab by hot press molding after its surface temperature is very high, the need to stack cooling. [0003] The conventional approach is carried out on a flap cooling means, the sheet material is cooled by natural ventilation. Moisture content of the sheet after hot pressing down the sheet moisture content core layer is approximately 6% to 7%, while the moisture content of the surface layer of 2% to 3%, so the sheet material in contact with the atmosphere, the sheet absorbed by the atmosphere moisture until the moisture balance. [0004] However, since the various parts of chipboard found in practice in contact with the atmosphere, would lead to uneven water absorption particleboard, the sheet material warpage easily occur, so there needs to operate the ...

Claims

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Application Information

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IPC IPC(8): F25D5/00F22B1/00B27N3/18
CPCF25D5/00F22B1/00B27N3/18
Inventor 周福现胡文亮
Owner 江苏瑞泰人造板有限公司