Method and Application of Grain Picking in Gallium Arsenide Chip Packaging Structure
A chip packaging structure and gallium arsenide technology, which is applied in the field of gallium arsenide chips, can solve the problems of inability to take complete grains, and achieve the effect of improving product performance and optimizing product structure
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[0079] As a preferred embodiment of the present invention, the method for extracting crystal grains from a gallium arsenide chip package structure includes the following steps:
[0080] (a) removing at least part of the substrate and at least part of the plastic package in the gallium arsenide chip package structure for pretreatment;
[0081] (b) placing the pretreated gallium arsenide chip package structure in the liquid composition for reaction, the reaction time is 15-20s, the temperature is 150-200°C, and then taken out for ultrasonic cleaning, the cleaning time is 10-30s, get grains;
[0082] Wherein, the liquid composition includes concentrated sulfuric acid, first nitric acid and second nitric acid, the mass fraction of the first nitric acid is 95-99.9%, the mass fraction of the second nitric acid is 65-70%, the concentrated sulfuric acid, the first nitric acid and the second nitric acid are The volume ratio of nitric acid is (2.5-3.0):(0.8-1.0):(0.4-0.6).
[0083] By...
Embodiment 1
[0095] This embodiment provides a method for extracting crystal grains from a gallium arsenide chip package structure, including the following steps:
[0096] (a) removing part of the substrate in the package structure of the gallium arsenide chip, and thinning the plastic package on the front, so as to preprocess the package structure of the gallium arsenide chip;
[0097] The gallium arsenide chip packaging structure includes a substrate, a die and a plastic package. The die is arranged on the surface of the substrate, and the plastic package encapsulates the die on the surface of the substrate. The substrate is a copper substrate, and the thickness of the copper substrate is is 60 μm, the material of the plastic encapsulation body is epoxy resin, and the encapsulation thickness of the plastic encapsulation body is 600 μm.
[0098] (b) placing the pretreated gallium arsenide chip package structure in 20 mL of the liquid composition for reaction, the reaction time is 15 s, th...
Embodiment 2
[0101] This embodiment provides a method for extracting crystal grains from a gallium arsenide chip package structure, except that the volume ratio of concentrated sulfuric acid, first nitric acid and second nitric acid in the liquid composition is 2.5:0.8:0.6, the remaining steps and process parameters Same as Example 1.
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