A mini/micro LED chip using Damascus technology and its manufacturing method

Abstract

The present invention relates to the field of LED technology, in particular to a mini / micro LED chip using a Damascus process and a manufacturing method thereof, the manufacturing method comprising the following steps: depositing a first passivation layer, polishing, and depositing SiN x Corrosion barrier layer, deposition of the second passivation layer, etching wire electrode pattern, pad electrode production, polishing surface electrode, sapphire thinning, final polishing, invisible dicing, splitting, complete chip production. The present invention adopts the damascene method to manufacture mini / micro LED pad tin electrodes, without etching the metal layer, can manufacture thick electrodes, and has high graphic accuracy, and can avoid the use of negative glue peeling or brushing solder paste on the packaging end, improving the process efficiency Stability; the combination of magnetron sputtering seed layer and electroplating can avoid the use of metal vapor deposition machines, there is no problem of contamination of vapor deposition machines and maintenance, and the production cost is low.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a mini / micro LED chip using a damascene process and a manufacturing method thereof. Background technique [0002] The existing mini / micro LED chips usually use Au electrodes in the pad electrode part. This process is the traditional way of LED manufacturing. However, for mini / micro LED chips, thick tin electrodes are usually required at the chip package end, and the thickness usually requires More than 20μm. [0003] At present, there are two ways to realize thick tin electrodes. One is to use traditional negative adhesive stripping technology to make thick tin electrodes on the chip side. This has several disadvantages. One is that it requires very thick negative photoresist, which gives Chip manufacturing brings difficulties. First, the photoresist that can reach such a thickness is very expensive; secondly, the resolution of the negative resist is lower than that of the positive...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a mini / micro LED chip using a Damascus process and a manufacturing method thereof. The manufacturing method adopts a Damascus process to manufacture mini / micro LED pad tin electrodes, which can avoid the use of negative adhesive stripping Or brush solder paste on the package side to make thick electrodes with high precision, which improves the stability of the process and facilitates client applications; the combination of sputtering seed layer and electroplating basically avoids the use of metal vapor deposition machines, without Pollution of vapor deposition machine, low maintenance cost

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