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Structure for realizing substrate heating function and preparation method

A substrate and function technology, which is applied in the field of structure and preparation for realizing the heating function of the substrate, can solve the problems of large weight and volume, complex process, poor heating effect, etc., and achieves the effect of simple process, low price, and poor heating effect.

Pending Publication Date: 2022-01-21
天津航空机电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a preparation method and structure for realizing the heating function of the substrate. Its purpose is to use spraying technology to prepare a coating structure with directional heat transfer on the heated part, so as to solve the problems in the current traditional electric heating method. Poor heating effect, complex process, large weight and volume

Method used

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  • Structure for realizing substrate heating function and preparation method
  • Structure for realizing substrate heating function and preparation method

Examples

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Embodiment 1

[0021] In this embodiment, the material composition and mass percentage content of the heating functional layer are: 2% graphene, 98% nickel-chromium alloy, and the composition and mass percentage content of the insulating and heat-insulating functional layer are: NiCrBSi 3%, ZrO 2 88%, resin 6%, curing agent 3%; the composition and mass percentage content of the insulating and heat-conducting functional layer are: NiCrBSi 4%, sealing agent 16%, AlN 80%.

[0022] In Example 1, use spraying technology to prepare on the glass fiber board, first carry out surface cleaning treatment, the specific process is: at room temperature, use sandblasting technology, ethyl acetate cleans the glass fiber board surface, after the treatment is completed, place it in a drying box ready for use. Each functional layer is obtained at room temperature using spraying technology. The specific process is: using supersonic flame spraying technology, setting the spraying process parameters as spraying...

Embodiment 2

[0025] In this embodiment, the material composition and mass percentage content of the heating functional layer are: 10% graphene, 90% nickel-chromium alloy, and the composition and mass percentage content of the insulating and heat-insulating functional layer are: NiCrBSi 1%, ZrO 2 96%, 2% resin, 1% curing agent; the composition and mass percentage content of the insulating and heat-conducting functional layer are: NiCrBSi 3%, sealing agent 2%, AlN 95%.

[0026] In Example 2, use spraying technology to prepare on glass fiber board, first carry out surface cleaning treatment, specific process is: at room temperature, use sandblasting technology, ethyl acetate cleans the surface of glass fiber board, place in drying box after treatment ready for use. Each functional layer is obtained at room temperature by spraying technology. The specific process is: using supersonic flame spraying technology, setting the spraying process parameters as spraying pressure 4MPa, spraying distanc...

Embodiment 3

[0029] In this embodiment, the material composition and mass percentage content of the heating functional layer are: 5% graphene, 95% nickel-chromium alloy, and the composition and mass percentage content of the insulating and heat-insulating functional layer are: NiCrBSi 2%, ZrO 2 94%, resin 2%, curing agent 2%; the composition and mass percentage content of the insulating and heat-conducting functional layer are: NiCrBSi 3%, sealing agent 2%, AlN 95%.

[0030] In Example 3, use spraying technology to prepare on glass fiber board, first carry out surface cleaning treatment, specific process is: at room temperature, use sandblasting technology, ethyl acetate cleans the surface of glass fiber board, place in drying box after treatment ready for use. Each functional layer is obtained at room temperature by spraying technology. The specific process is: using supersonic flame spraying technology, setting the spraying process parameters as spraying pressure 4MPa, spraying distance...

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Abstract

The invention provides a structure for realizing a substrate heating function and a preparation method. The structure comprises an insulation heat conduction function layer, a heating function layer, an insulation heat insulation function layer and an external protection layer, and when a certain voltage or current is in access, a certain heating temperature can be generated. According to the preparation method for the structure for realizing the substrate heating function, the heating function and the temperature feedback function are integrated on a heated part by using a spraying technology, so that the problems of a poor heating effect, a complex process and a large weight and volume in the traditional electric heating manner at present are solved.

Description

technical field [0001] The invention relates to the field of electric heating, in particular to a structure and a preparation method for realizing the heating function of a substrate. Background technique [0002] Airplanes fly at high altitudes where the temperature is relatively low, and icing is prone to occur at lip intakes and other parts. In order to ensure the flight safety of the aircraft, it is necessary to use electric heating products to heat the parts that are prone to icing. The heating body of this electric heating method uses armored heating wire, heating sheet or heating block as the heating element, and is fixed to the part to be heated by winding, gluing and other processes, so as to realize the heating and anti-icing function. Because the shape of the heating element does not match the shape of the heated part, the gap is large, which will cause long heating time, uneven heating, large thermal stress, resulting in material fatigue and easy damage. At the ...

Claims

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Application Information

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IPC IPC(8): C23C4/129C23C4/02C23C4/067C23C4/06H05B3/14
CPCC23C4/129C23C4/02C23C4/067C23C4/06H05B3/14
Inventor 梁振宗崔艳超赵艳萍王兴华
Owner 天津航空机电有限公司