Waste treatment method and equipment for electronic component supporting plate
A technology for waste treatment and electronic components, applied in electric furnaces, crucible furnaces, rotary drum furnaces, etc., can solve problems such as a large amount of waste water, waste gas and solid waste, troublesome extraction and processing, and achieve the effect of full utilization
Pending Publication Date: 2022-01-25
黄石加柯环保科技有限公司
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Problems solved by technology
[0003] The existing PCB waste treatment process will produce a large amount of waste water, waste gas and solid waste, and the subsequent extraction and treatment are also troublesome. For example, harmful substances such as dioxins are easily generated during the incineration process of PCBs
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[0041] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.
[0042] In some processes described in the specification and claims of the present invention and the above-mentioned drawings, a plurality of operations appearing in a specific order are contained, but it should be clearly understood that these operations may not be performed in the order in which they appear herein Execution or parallel execution, the serial number of the operation, such as 100, 200, etc., is only used to distinguish different operations, and the serial number itself does not represent any execution order. Additionally, these processes can include more or fewer operations, and these operations can be performed sequentially or in parallel. It should be noted t...
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The invention discloses waste treatment equipment for an electronic component supporting plate. The waste treatment equipment comprises a raw material crushing device, a conveying device, a fluidized bed furnace, a waste heat boiler, a quench tower and a dust remover. The raw material crushing device is used for crushing the electronic element supporting plate into preset granularity. The raw material crushing device is connected with the fluidized bed furnace. The fluidized bed furnace comprises a fan, a hearth and a secondary combustion chamber, and the hearth is adjacent to and communicates with the secondary combustion chamber. The furnace bottom of the hearth comprises at least one slope, a plurality of air inlets are formed in the slope, a plurality of air inlets are formed in each furnace wall of the hearth, and the fan communicates with the air inlets. The furnace tail of the fluidized bed furnace is connected with the waste heat boiler. The waste heat boiler is connected with the quench tower. The quench tower is connected with the dust remover. The conveying device is used for transferring materials in the waste treatment equipment in the waste treatment equipment according to a preset sequence. According to the waste treatment equipment for the electronic component supporting plate, harmless decrement treatment can be conducted on PCBs, the influence on the environment is small, and in addition, full utilization of energy can be achieved.
Description
technical field [0001] The invention relates to the technical field of electronic waste treatment, and more particularly, to a waste treatment method and treatment equipment for electronic component support plates. Background technique [0002] PCB (printed circuit board) is a printed circuit board, referred to as a printed board, and is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from small electronic watches to large computer servers, as long as there is an integrated circuit composed of electronic components, PCBs are used to achieve electrical interconnection between various electronic components. PCB is usually composed of an insulating base plate, connecting wires and pads for assembling and welding electronic components, and has the dual functions of conductive lines and insulating base plate. The constituent raw materials of printed circuit boards include metallic copper. As copper becomes more exp...
Claims
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IPC IPC(8): C22B7/02C22B11/00C22B15/00
CPCC22B7/02C22B11/025C22B15/00
Inventor 吴昊泉彭园园
Owner 黄石加柯环保科技有限公司