Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Carrier tape for 5G chip PVD process and manufacturing method thereof

A manufacturing method and chip technology, applied in the direction of film/flaky adhesives, coatings, adhesive additives, etc., can solve the problems of unstable carrier tape viscosity, low process yield, easy chip drop, etc., to achieve good Antistatic ability, high process yield, and long-lasting effect

Pending Publication Date: 2022-01-28
SHENZHEN HORAE TECH
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the existing carrier tapes are not viscous, easy to fall off and easy to leave glue when removed, and the yield rate of the process is low.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Carrier tape for 5G chip PVD process and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0037] Further, the preparation method of described composite acrylic glue comprises the following steps:

[0038] S11, put acrylic glue, inorganic filler, anti-aging agent, antibacterial and antifungal agent, coupling agent and plasticizer into the temperature-controllable reaction kettle, raise the temperature to 75°C, start the stirrer to stir for 35min-40min, and the stirring speed is 155r / min~160r / min, the mixture A is prepared at this time;

[0039] S12, send the carbon nanotubes and lithium sulfate into the reaction kettle, adjust the stirring speed to 310r / min-350r / min, and obtain the composite acrylic glue after stirring evenly.

[0040] Further, the plasticizer is an epoxy plasticizer.

[0041]Further, the specific steps of defoaming casting technology in S2 are as follows: coating the polyamic acid added with nano aggregates on the carrier, sending it into a tunnel oven, raising the temperature in stages, at 345°C to 250°C , heated for 35min-40min, and then reacte...

Embodiment example 1

[0046] Weigh 55 parts of acrylic glue, 35 parts of inorganic filler, 1 part of anti-aging agent, 0.2 part of antibacterial and antifungal agent, 12 parts of coupling agent, 10 parts of plasticizer, 5 parts of carbon nanotubes and 10 parts of lithium sulfate. Put glue, inorganic filler, anti-aging agent, antibacterial and antifungal agent, coupling agent and plasticizer into the temperature-controllable reaction kettle, raise the temperature to 75°C, start the stirrer to stir for 40min, and the stirring speed is 160r / min. Prepare mixture A, send carbon nanotubes and lithium sulfate into the reaction kettle, adjust the stirring speed to 350r / min, and obtain the composite acrylic glue after stirring evenly;

[0047] Weigh 70 parts of pyromellitic dianhydride, 60 parts of dimethyl acetyl, 5 parts of composite nanoparticles, 90 parts of organosol, 40 parts of p-phenylenediamine, 25 parts of polyethylene glycol, 25 parts of ethanol, antistatic liquid 45 parts and 30 parts of composi...

Embodiment example 2

[0052] Weigh 55 parts of acrylic glue, 35 parts of inorganic filler, 1 part of anti-aging agent, 0.2 part of antibacterial and antifungal agent, 12 parts of coupling agent, 10 parts of plasticizer, 6 parts of carbon nanotubes and 11 parts of lithium sulfate. Put glue, inorganic filler, anti-aging agent, antibacterial and antifungal agent, coupling agent and plasticizer into the temperature-controllable reaction kettle, raise the temperature to 75°C, start the stirrer to stir for 40min, and the stirring speed is 160r / min. Prepare mixture A, send carbon nanotubes and lithium sulfate into the reaction kettle, adjust the stirring speed to 350r / min, and obtain the composite acrylic glue after stirring evenly;

[0053] Weigh 70 parts of pyromellitic dianhydride, 60 parts of dimethyl acetyl, 10 parts of composite nanoparticles, 90 parts of organosol, 40 parts of p-phenylenediamine, 25 parts of polyethylene glycol, 25 parts of ethanol, antistatic liquid 45 parts and 30 parts of compos...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of chip accessories, in particular to a carrier tape for a 5G chip PVD process and a manufacturing method thereof. The carrier tape comprises the following components in parts by weight: 30-70 parts of pyromellitic dianhydride, 20-60 parts of dimethyl acetyl, 5-15 parts of composite nanoparticles, 40-90 parts of organic sol, 30-40 parts of p-phenylenediamine, 20-25 parts of polyethylene glycol, 20-25 parts of ethanol, 30-45 parts of an antistatic liquid and 20-30 parts of a composite acrylic acid glue solution. According to the invention, the problems that the existing carrier tape is unstable in viscidity, easy to fall off, easy to remain glue when being taken down, and low in process yield can be effectively solved.

Description

technical field [0001] The invention relates to the technical field of chip accessories, in particular to a carrier tape for 5G chip PVD process and a manufacturing method thereof. Background technique [0002] The carrier tape is the carrier device used in the 5G chip PVD process. [0003] At present, the existing carrier tapes are not viscous, easy to fall off and easy to leave glue when removed, and the yield rate of the process is low. [0004] In summary, the present invention solves the existing problems by designing a carrier tape for 5G chip PVD process and its manufacturing method. Contents of the invention [0005] The purpose of the present invention is to provide a carrier tape for 5G chip PVD process and its manufacturing method, so as to solve the problems raised in the above-mentioned background technology. [0006] To achieve the above object, the present invention provides the following technical solutions: [0007] A carrier tape for 5G chip PVD proces...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/30C09J4/00C09J11/04C08J5/18C08J7/04C08L77/00C08L81/00C08K3/36C08K3/34
CPCC09J7/25C09J7/30C09J4/00C09J11/04C08J5/18C08J7/0427C08J2377/00C08J2481/00C08K3/36C08K3/34C09J2203/326
Inventor 李英顺苏青青
Owner SHENZHEN HORAE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com