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Composite microcolumn-porous surface structure for enhancing boiling heat transfer

A technology to enhance boiling and surface structure, applied in electrical components, electric solid devices, circuits, etc., can solve problems such as deteriorating heat transfer, affecting boiling heat transfer effect, reducing heat transfer area, etc., to increase heat transfer area, enhance The effect of boiling heat transfer and the effect of reducing heat loss

Inactive Publication Date: 2022-02-08
ANHUI UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still some areas to be improved in this application. Air bubbles are still generated at the bottom of the heating surface, resulting in an overall gas film on the heating surface to deteriorate heat transfer. In addition, due to the generation of gas films on the side and bottom of the column, the heat transfer process Affected, the heat transfer area that actually uses the phase change of the heating fluid is reduced, which affects the boiling heat transfer effect; in addition, when using this microstructure surface to heat, it still requires a high degree of wall superheat to reach the boiling state

Method used

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  • Composite microcolumn-porous surface structure for enhancing boiling heat transfer
  • Composite microcolumn-porous surface structure for enhancing boiling heat transfer
  • Composite microcolumn-porous surface structure for enhancing boiling heat transfer

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Embodiment 1

[0032] Such as Figure 1-Figure 4 As shown, a composite microcolumn-porous surface structure for enhancing boiling heat transfer in this embodiment includes a heating substrate 101 and several microcolumn structures arranged on the surface of the heating substrate 101. The microcolumn structure consists of an internal high It consists of a thermally conductive inner core 103, a high thermal resistance wall 102 surrounding the outside, and a porous capillary core 104 at the top, and channels are formed between several microcolumn structures. Specifically, the high thermal conductivity inner core 103 is made of a high thermal conductivity material whose thermal conductivity is not lower than 2000W / m·K. The high thermal resistance wall surface 102 is made of high thermal resistance material, and its thermal conductivity is below 0.05W / m·K.

[0033] In this embodiment, the micro-column structure can adopt various structural forms, such as cylindrical, conical, etc., or a columnar...

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PUM

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Abstract

The invention discloses a composite microcolumn-porous surface structure for enhancing boiling heat transfer, and belongs to the field of boiling heat transfer enhancing. The structure comprises a heating substrate and a plurality of micro-column-shaped composite porous surface micro-structures on the substrate. The tops of the micro-column structures are capillary cores made of a porous material, the bottoms of the micro-column structures are made of a composite material, the interiors of the structures are made of a high-thermal-conductivity material, the exteriors of the structures are wrapped with a layer of high-thermal-resistance materials, and channels are formed among the micro-structures. According to the surface structure, heat is introduced into fluid through the high-heat-conductivity micro-columns, the porous material is used for increasing the gasification core, reducing the boiling starting point and sucking the supplied liquid, the temperature superheat degree of the boiling wall surface is reduced, and the bubble separation rate is increased; and a fluid working medium is timely ejected into the porous core to form a stable gas-liquid flowing path, a gas film formed by direct boiling on a heating surface is avoided, and boiling heat transfer is enhanced.

Description

technical field [0001] The invention relates to the technical field of enhanced boiling heat transfer, more specifically, relates to a composite microcolumn-porous surface structure for enhanced boiling heat transfer. Background technique [0002] As an efficient energy transfer method accompanied by gas-liquid phase transition, boiling heat transfer has the characteristics of small heat transfer temperature difference and high heat flux density. Higher requirements are put forward, and accordingly the application of boiling heat transfer will have huge advantages. [0003] There are already related patent proposals for enhanced boiling heat transfer surfaces, such as patent publication number: CN111223826B, published on June 2, 2020, and the name of the invention is: An enhanced boiling utilizing the synergistic effect of microstructure and composite wettability Heat transfer surface, the application discloses an enhanced boiling heat transfer surface utilizing the synergi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427
CPCH01L23/427
Inventor 汪冬冬何孝磊楚化强陈杰林琦葛亚杨磊
Owner ANHUI UNIVERSITY OF TECHNOLOGY
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